7 Machines and machine tools for the assembly and packaging of electronic chips and structural parts and fittings therefor; machines for manufacturing semiconductors, and structural parts and fittings therefor; semiconductor manufacturing machines; semiconductor manufacturing machines and systems composed of a vacuum chamber for accommodating semiconductor wafers and structural parts and fittings therefor; structural parts and machines for handling and transferring semiconductor wafers into and out of vacuum chambers, and structural parts and fittings therefor; machines and machine tools for the treatment of semiconductor wafers, namely, thermal treatment reactors and chemical vapor deposition reactors, chemical reactors for the thermal treatment of semiconductor wafers; machines for the plasma assisted manufacture of semiconductors, namely, vacuum treatment machines for plasma assisted deposition, and vacuum machines for depositing fine films; plasma enhanced deposition machines, namely, semiconductor manufacturing machines utilizing plasma-enhanced deposition, and structural parts and fittings therefor; industrial surface treatment equipment, namely, vacuum plasma treatment systems comprised of a high frequency, high voltage generator, controls, and treatment chamber, and structural fittings and parts therefor; semiconductor wafer processing reactors for the chemical treatment and the thermal treatment of semiconductor wafers and for the chemical cleaning of semiconductor wafers by means of a gas phase process, also with the use of plasma, namely, gas discharge industrial chemical reactors, and structural parts and fittings therefore; industrial robots for the handling of semiconductor wafers.