Trademark: 98287033
Word
EMC
Status Date
Thursday, January 18, 2024
Filing Date
Monday, November 27, 2023
6 copper clad laminates for use in the manufacture of printed circuit boards; metal clad substrates for use in the manufacture of printed circuit boards
The mark consists of the letters EMC in stylized 3D font.
Color is not claimed as a feature of the mark.
Jan 18, 2024
New Application Office Supplied Data Entered
Nov 30, 2023
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24