7 Machines for the assembly and packaging of electronic semiconductor chips; machines for manufacturing semiconductors, and structural parts therefor; semiconductor manufacturing machines; semiconductor manufacturing machines and systems composed of a vacuum chamber for accommodating semiconductor wafers and structural parts therefor and machines for handling and transferring semiconductor wafers into and out of the vacuum chamber, and structural parts therefor; machines for the treatment of semiconductor wafers, namely, semi-conductor wafer processing machines; industrial robots for the handling of semiconductor wafers; machines for the assembly and packaging of electronic chips; industrial chemical reactors; industrial robots; Industrial surface treatment equipment, namely, vacuum plasma treatment systems comprised of a high frequency, high voltage generator, controls, and treatment chamber, and structural parts therefor; reactors for processing semiconductor wafers, namely, industrial chemical reactors for the thermal treatment of semiconductor wafers; industrial chemical reactors, namely, semiconductor wafer processing reactors for the chemical treatment and the thermal treatment of semiconductor wafers and for the chemical cleaning of semiconductor wafers by means of a gas phase process, also with the use of plasma, namely, gas discharge