Trademark: 97839570
Status Date
Wednesday, December 13, 2023
Filing Date
Wednesday, March 15, 2023
40 Crystal wafer etching treatment; Integrated circuit etching treatment; Semiconductor sealing processing; Wafer Foundry; Custom manufacture of semiconductors for others; Manufacture and assembly of automotive semiconductors according to customer's specifications and instructions; Manufacturing and assembling services for automotive wafers according to customer's specifications and instructions; Services of manufacturing and assembling semiconductors and integrated circuits according to customer specifications; Manufacturing silicon wafers and integrated circuits according to customer instructions; Assembly services of silicon wafers and integrated circuits; Polishing services for silicon wafers and semiconductors; Assembling integrated circuits, photomasks and electronic or computer chips for others; Foundry services of semiconductors and integrated circuits; Semiconductor and integrated circuit packaging processing; Foundry semiconductor chip cutting and packaging processing services; Wafer etching and dicing processing; Etching processing; Cutting or forming of integrated circuits; Manufacturing and processing of integrated circuits
The mark consists of two stylized non-Latin characters.
Color is not claimed as a feature of the mark.
Jan 30, 2024
Teas Response To Office Action Received
Dec 13, 2023
Notification Of Non-Final Action E-Mailed
Dec 13, 2023
Non-Final Action E-Mailed
Dec 13, 2023
Non-Final Action Written
Dec 12, 2023
Assigned To Examiner
Apr 5, 2023
Notice Of Design Search Code E-Mailed
Apr 4, 2023
New Application Office Supplied Data Entered
Mar 18, 2023
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
