Trademark: 97767075
Word
QCIA
Status
Pending
Status Code
688
Status Date
Tuesday, June 18, 2024
Serial Number
97767075
Mark Type
4
Filing Date
Wednesday, January 25, 2023
Published for Opposition
Tuesday, April 23, 2024

Trademark Owner History
Salama, Islam - Owner At Publication

Classifications
9 Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device
42 Research, design and development of technologies for the fabrication of electronic and microelectronic systems, devices and components in the nature of microelectronic packaging, patterning of microelectronic circuits on the chip, patterning of microelectronic circuits off the Chip and on the package device, patterning of microelectronic circuits off the Chip and on the interposer device, patterning of microelectronic circuits on main circuit board substrate, patterning of microelectronic circuits on mother board device, formation of a point to point omni directional electronic connection, formation of a point to point omni directional optical interconnect, and for fabrication of multilayer interconnect packaging device with fine feature and die stacking

Trademark Events
Jan 28, 2023
New Application Entered
Feb 13, 2023
New Application Office Supplied Data Entered
Oct 24, 2023
Assigned To Examiner
Nov 13, 2023
Priority Action Written
Nov 13, 2023
Priority Action E-Mailed
Nov 13, 2023
Notification Of Priority Action E-Mailed
Feb 12, 2024
Teas Response To Office Action Received
Feb 12, 2024
Correspondence Received In Law Office
Feb 12, 2024
Teas/Email Correspondence Entered
Mar 19, 2024
Approved For Pub - Principal Register
Apr 3, 2024
Notification Of Notice Of Publication E-Mailed
Apr 3, 2024
Notification Of Notice Of Publication E-Mailed
Apr 23, 2024
Published For Opposition
Apr 23, 2024
Official Gazette Publication Confirmation E-Mailed
Jun 18, 2024
Noa E-Mailed - Sou Required From Applicant

Trademark Alertz updated from USPTO on 2030-01-24