9 Silicon substrates, namely, silicon wafers, silicon wafer carriers, silicon wafer substrates; silicon carbide substrates, namely, silicon carbide wafers, silicon carbide wafer carriers, silicon carbide substrates, semiconductor wafers of silicon carbide insulating wafer of silicon carbide, semi insulating wafers of silicon carbide and dielectric wafers built on silicon carbide; semiconductor substrates, namely, organic multilayer laminates supporting silicon carbide chips, organic multilayer laminate supporting non silicon carbide semiconductor wafers, semiconductor substrates supporting optical interconnect, semiconductor substrate supporting electrical interconnect, semiconductor substrate supporting both optical and electrical interconnect together; semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; semiconductor power components, namely, silicone interposers; semiconductor power components, namely, silicon carbide interposers; semiconductor power components, namely, interposers for semiconductor packaging, chips and circuit boards; semiconductor packaging materials in the nature of semiconductor interposers, semiconductor substrates, semiconductor routing layers for packaging, packaging substrates, packaging thermal management substrates, packaging heat spreading device, packaging power delivery device