Trademark: 97728199
Word
TSMC DIGITIZED FAB
Status Date
Tuesday, March 26, 2024
Filing Date
Thursday, December 22, 2022
Published for Opposition
Tuesday, April 30, 2024
40 Custom manufacture of semiconductors, memory chips, wafers and integrated circuits
The mark consists of the wording "TSMC" which is superimposed on a stylized semiconductor wafer design which is underlined and underneath are the terms "DIGITIZED FAB".
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY DIGITIZED FAB
Color is not claimed as a feature of the mark.
"DIGITIZED FAB"
Apr 10, 2024
Notification Of Notice Of Publication E-Mailed
Mar 25, 2024
Approved For Pub - Principal Register
Mar 22, 2024
Teas/Email Correspondence Entered
Mar 22, 2024
Correspondence Received In Law Office
Mar 21, 2024
Assigned To Lie
Nov 2, 2023
Teas Response To Office Action Received
Oct 13, 2023
Notification Of Non-Final Action E-Mailed
Oct 13, 2023
Non-Final Action E-Mailed
Oct 13, 2023
Non-Final Action Written
Sep 23, 2023
Assigned To Examiner
Jan 20, 2023
Notice Of Design Search Code E-Mailed
Jan 19, 2023
New Application Office Supplied Data Entered
Dec 26, 2022
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
