Trademark: 97716747
Status Date
Tuesday, November 14, 2023
Filing Date
Wednesday, December 14, 2022
Published for Opposition
Tuesday, September 19, 2023
7 Machines for electronics assembly, particularly in the semiconductor assembly field, specifically die attach machines, thermocompression bonding machines, and flip chip bonding machines
Nov 14, 2023
Noa E-Mailed - Sou Required From Applicant
Sep 19, 2023
Official Gazette Publication Confirmation E-Mailed
Sep 19, 2023
Published For Opposition
Aug 30, 2023
Notification Of Notice Of Publication E-Mailed
Aug 14, 2023
Approved For Pub - Principal Register
Aug 10, 2023
Examiner's Amendment Entered
Aug 10, 2023
Notification Of Examiners Amendment E-Mailed
Aug 10, 2023
Examiners Amendment E-Mailed
Aug 10, 2023
Examiners Amendment -Written
Aug 3, 2023
Assigned To Examiner
Jan 10, 2023
New Application Office Supplied Data Entered
Dec 17, 2022
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24