Trademark: 97674221
Word

Status
Pending
Status Code
686
Status Date
Tuesday, May 7, 2024
Serial Number
97674221
Mark Type
2
Filing Date
Friday, November 11, 2022
Published for Opposition
Tuesday, May 7, 2024

Trademark Owner History

Classifications
40 Etching of semiconductor wafers; custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules; etching of integrated circuits; semiconductor wafer-level processing, namely, custom manufacture of semiconductor wafers; wafer foundry;, namely, custom manufacture of semiconductor wafers; custom manufacture of integrated circuit packaging; custom manufacture of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers to the order and specification of customers; consulting with respect to semiconductor packaging technology, namely, consulting regarding manufacturing of semiconductor packaging
9 Chips being integrated circuits; circuit board; semiconductors; semiconductor substrates, namely, the supporting material upon which or within which the elements of a semiconductor device are fabricated or attached; micro-circuit; integrated circuits; electronic circuit; printed circuit boards; semiconductor chip; semiconductor components, namely, integrated circuits, diodes, transistors, components for interconnecting semiconductors; integrated circuit board; semiconductor wafers; semiconductor packages, namely, semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules
42 Technology research and development for others in the field of semiconductor related products; integrated circuits design; semiconductor packaging design; semiconductor substrate design; quality control inspection for semiconductors and related products; testing of semiconductors and related products; quality identification, namely, quality control inspection of semiconductors and related products; consulting with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development
The mark consists of the design of a sun with a smiling face where the left upper portion of the face is green with a yellow eye, a curved yellow bar representing the left half of the mouth, and a green triangular border forming the sun's rays; the right upper portion of the face is orange with a blue eye inside a blue triangular border forming the sun's rays on the right and on the bottom of the sun, and the lower right portion of the face is yellow with a blue curved bar representing the right half of the mouth.
The color(s) green, yellow, orange, and blue is/are claimed as a feature of the mark.

Trademark Events
Nov 15, 2022
New Application Entered
Dec 4, 2022
New Application Office Supplied Data Entered
Dec 6, 2022
Notice Of Design Search Code E-Mailed
Aug 2, 2023
Assigned To Examiner
Aug 9, 2023
Non-Final Action Written
Aug 9, 2023
Non-Final Action E-Mailed
Aug 9, 2023
Notification Of Non-Final Action E-Mailed
Oct 5, 2023
Teas Response To Office Action Received
Feb 27, 2024
Assigned To Lie
Feb 28, 2024
Correspondence Received In Law Office
Feb 28, 2024
Teas/Email Correspondence Entered
Apr 3, 2024
Approved For Pub - Principal Register
Apr 17, 2024
Notification Of Notice Of Publication E-Mailed
May 7, 2024
Official Gazette Publication Confirmation E-Mailed
May 7, 2024
Published For Opposition

Trademark Alertz updated from USPTO on 2030-01-24