40 Etching of semiconductor wafers; custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings, semiconductor integrated circuit modules; etching of integrated circuits; semiconductor wafer-level processing, namely, custom manufacture of semiconductor wafers; wafer foundry, namely, custom manufacture of semiconductor wafers; custom manufacture of integrated circuit packaging; custom manufacture of semiconductor substrates, semiconductors, integrated circuits, integrated circuit boards, and wafers to the order and specification of customers; consulting with respect to semiconductor packaging technology, namely, consulting regarding manufacturing of semiconductor packaging