7 Machines and apparatus for the severing, production, alignment, adjustment, linking, coating, development, cleaning, printing, lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular transistors and wafers; parts and equipment for machines and apparatus for the severing, production, alignment, adjustment, linking, coating, development, cleaning, printing, lithographic treatment, in particular nanostructure imprinting, hot stamping, micro-contact printing, testing, and manufacturing of electronic circuits and semiconductors, in particular, transistors and wafers; installations for processing semiconductors, namely, severing a substrate, in particular for processing semiconductors under vacuum; installations for conveying semiconductors, namely, belt conveyors; installations and systems for the surface treatment of semiconductors, namely, removal of oxides from surfaces, in particular through sputtering; installations and systems for etching semiconductor surfaces comprising plasma generating parts; installations for vaporising semiconductor surfaces, in particular under vacuum (CVD processes); installations for conveying, providing, and processing semiconductors, namely, apparatuses containing robot arms for wafer transport; installations for conveying, processing, and providing flat screens, namely, imprint apparatuses; machines and turnkey production installations for manufacturing semiconductor components from the semiconductor backend sector and for manufacturing light diodes; machines for semiconductor manufacturing; machines for memory and microcontroller chip manufacturing and memory and microcontroller chip assembly