Trademark: 97503590
Status Date
Tuesday, February 6, 2024
Filing Date
Thursday, July 14, 2022
9 solder bump deposition system and indium deposition system, namely, apparatus for depositing thin films of indium and solder bumps on semiconductor wafers and on glass
Feb 6, 2024
Report Completed Suspension Check Case Still Suspended
Aug 8, 2023
Notification Of Letter Of Suspension E-Mailed
Aug 8, 2023
Letter Of Suspension E-Mailed
Aug 8, 2023
Suspension Letter Written
Jul 10, 2023
Teas/Email Correspondence Entered
Jul 10, 2023
Correspondence Received In Law Office
Jul 10, 2023
Teas Response To Office Action Received
May 3, 2023
Notification Of Non-Final Action E-Mailed
May 3, 2023
Non-Final Action E-Mailed
May 3, 2023
Non-Final Action Written
Apr 28, 2023
Assigned To Examiner
Aug 3, 2022
New Application Office Supplied Data Entered
Trademark Alertz updated from USPTO on 2030-01-24