Trademark: 97474212
Word
ABSOLICS
Status Date
Thursday, January 4, 2024
Filing Date
Friday, June 24, 2022
Published for Opposition
Tuesday, November 29, 2022
9 Semiconductor packages, namely, semiconductor chip sets; printed circuit boards; electronic circuit boards; flexible circuit boards; electronic integrated circuits; integrated circuit modules; 3D integrated circuits; large-scale integrated circuits; electronic memory circuits; circuit boards provided with integrated circuits; semiconductor packages being semiconductor chip sets; glass substrates in the nature of glass covered with an electrical conductor for use in semiconductors; daughter boards; digital circuit boards; motherboards; semiconductor boards; mother boards; lead frames for semiconductors, namely, semiconductor lead frames; memory modules; random access memory modules, namely, memory modules
The mark consists of the word "ABSOLICS" rendered in stylized lettering.
Color is not claimed as a feature of the mark.
Jan 4, 2024
Sou Extension 2 Granted
Jan 4, 2024
Sou Extension 2 Filed
Jan 4, 2024
Sou Teas Extension Received
Jul 11, 2023
Notice Of Approval Of Extension Request E-Mailed
Jul 7, 2023
Sou Extension 1 Granted
Jul 7, 2023
Sou Extension 1 Filed
Jul 7, 2023
Sou Teas Extension Received
Jan 24, 2023
Noa E-Mailed - Sou Required From Applicant
Nov 29, 2022
Official Gazette Publication Confirmation E-Mailed
Nov 29, 2022
Published For Opposition
Nov 9, 2022
Notification Of Notice Of Publication E-Mailed
Oct 25, 2022
Approved For Pub - Principal Register
Oct 21, 2022
Notification Of Letter Of Suspension E-Mailed
Oct 21, 2022
Letter Of Suspension E-Mailed
Oct 21, 2022
Suspension Letter Written
Oct 21, 2022
Examiner's Amendment Entered
Oct 21, 2022
Notification Of Examiners Amendment E-Mailed
Oct 21, 2022
Examiners Amendment E-Mailed
Oct 21, 2022
Examiners Amendment -Written
Oct 14, 2022
Assigned To Examiner
Jul 13, 2022
New Application Office Supplied Data Entered
Jun 28, 2022
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24