Trademark: 97425603
Status Date
Tuesday, December 12, 2023
Filing Date
Tuesday, May 24, 2022
Published for Opposition
Tuesday, October 18, 2022
7 Machines for semiconductor processing and packaging, including semiconductor wafers; specifically wire bonding machines and machines for forming conductive structures on wafers using wire
Dec 14, 2023
Notice Of Approval Of Extension Request E-Mailed
Dec 12, 2023
Sou Extension 2 Granted
Dec 12, 2023
Sou Extension 2 Filed
Dec 12, 2023
Sou Teas Extension Received
Jun 6, 2023
Notice Of Approval Of Extension Request E-Mailed
Jun 2, 2023
Sou Extension 1 Granted
Jun 2, 2023
Sou Extension 1 Filed
Jun 2, 2023
Sou Teas Extension Received
Dec 13, 2022
Noa E-Mailed - Sou Required From Applicant
Oct 18, 2022
Official Gazette Publication Confirmation E-Mailed
Oct 18, 2022
Published For Opposition
Sep 28, 2022
Notification Of Notice Of Publication E-Mailed
Sep 13, 2022
Approved For Pub - Principal Register
Sep 11, 2022
Assigned To Examiner
May 31, 2022
New Application Office Supplied Data Entered
May 27, 2022
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24