Trademark: 97305153
Status Date
Thursday, February 8, 2024
Filing Date
Thursday, March 10, 2022
Published for Opposition
Tuesday, June 13, 2023
6 Solder preforms of metal; Solder wire; Wire; Metal ribbon, namely, metal bonding wire and metal bonding ribbon; Solder preforms of metal, wire, and metal ribbons, namely, metal bonding wire and metal bonding ribbon for use in the electronics industry; Metal bonding pads; Metal stampings, namely, stamped metals and metal alloys for use in manufacture of electronics
The mark consists of stylized logo.
Feb 9, 2024
Notice Of Approval Of Extension Request E-Mailed
Feb 8, 2024
Sou Extension 1 Granted
Feb 8, 2024
Sou Extension 1 Filed
Feb 8, 2024
Sou Teas Extension Received
Aug 8, 2023
Noa E-Mailed - Sou Required From Applicant
Jun 13, 2023
Official Gazette Publication Confirmation E-Mailed
Jun 13, 2023
Published For Opposition
May 24, 2023
Notification Of Notice Of Publication E-Mailed
May 7, 2023
Approved For Pub - Principal Register
Apr 5, 2023
Teas/Email Correspondence Entered
Apr 5, 2023
Correspondence Received In Law Office
Apr 5, 2023
Teas Response To Office Action Received
Mar 15, 2023
Application Extension Granted/Receipt Provided
Mar 15, 2023
Application Extension To Response Period - Received
Jan 3, 2023
Notification Of Non-Final Action E-Mailed
Jan 3, 2023
Non-Final Action E-Mailed
Jan 3, 2023
Non-Final Action Written
Dec 21, 2022
Assigned To Examiner
Mar 16, 2022
Notice Of Design Search Code E-Mailed
Mar 15, 2022
New Application Office Supplied Data Entered
Mar 14, 2022
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
