Trademark: 97280054
Status Date
Tuesday, December 26, 2023
Registration Number
7255964
Registration Date
Tuesday, December 26, 2023
Filing Date
Wednesday, February 23, 2022
Published for Opposition
Tuesday, January 10, 2023
7 Semiconductor wafer processing equipment, namely, an integrated tool for the performance of hybrid bonding chip packaging techniques
Dec 26, 2023
Notice Of Registration Confirmation Emailed
Dec 26, 2023
Registered-Principal Register
Nov 22, 2023
Notice Of Acceptance Of Statement Of Use E-Mailed
Nov 21, 2023
Allowed Principal Register - Sou Accepted
Nov 21, 2023
Teas/Email Correspondence Entered
Nov 21, 2023
Correspondence Received In Law Office
Nov 21, 2023
Teas Response To Office Action Received
Aug 25, 2023
Notification Of Non-Final Action E-Mailed
Aug 25, 2023
Non-Final Action E-Mailed
Aug 25, 2023
Su - Non-Final Action - Written
Aug 11, 2023
Statement Of Use Processing Complete
Jul 31, 2023
Use Amendment Filed
Aug 10, 2023
Case Assigned To Intent To Use Paralegal
Jul 31, 2023
Teas Statement Of Use Received
Mar 7, 2023
Noa E-Mailed - Sou Required From Applicant
Jan 10, 2023
Official Gazette Publication Confirmation E-Mailed
Jan 10, 2023
Published For Opposition
Dec 21, 2022
Notification Of Notice Of Publication E-Mailed
Dec 6, 2022
Approved For Pub - Principal Register
Dec 6, 2022
Assigned To Examiner
Mar 1, 2022
New Application Office Supplied Data Entered
Feb 26, 2022
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
