Trademark: 97252047
Status Date
Tuesday, September 27, 2022
Registration Number
6859492
Registration Date
Tuesday, September 27, 2022
Filing Date
Thursday, February 3, 2022
Published for Opposition
Tuesday, July 12, 2022
1 Chemical used in metallization of circuit boards and integrated chips; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates
Sep 27, 2022
Notice Of Registration Confirmation Emailed
Sep 27, 2022
Registered-Principal Register
Jul 12, 2022
Official Gazette Publication Confirmation E-Mailed
Jul 12, 2022
Published For Opposition
Jun 22, 2022
Notification Of Notice Of Publication E-Mailed
Jun 8, 2022
Approved For Pub - Principal Register
May 28, 2022
Assigned To Examiner
Feb 8, 2022
New Application Office Supplied Data Entered In Tram
Feb 7, 2022
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24