Word

WELCO

Status

Registered

Status Code

700

Status Date

Tuesday, December 26, 2023

Serial Number

97068631

Registration Number

7251588

Registration Date

Tuesday, December 26, 2023

Mark Type

4000

Filing Date

Monday, October 11, 2021

Published for Opposition

Tuesday, October 10, 2023

Trademark Owner History

Heraeus Deutschland GmbH & Co. KG - Original Registrant

Classifications

9 Lead-free solder, namely, tin comprising solder, for the microelectronics industry, in particular the microelectronics chip industry; all of the above-mentioned goods for use in chip production, namely, for use as soldering pastes comprising solder metal and/or its alloys and flux, conductive inks comprising solder metal and/or its alloys and flux for surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches or line space from 100 nanometers to 200 micrometers; all the above-mentioned goods for use in chip production, namely, for use in the production of surface mountable devices (SMD), surface mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuit boards with pitches or line space from 100 nanometers up to 200 micrometers; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry or iron-containing components, or in the field of gas and water pipes; all aforementioned goods for depositing, in particular by printing, underfill technologies for flip-chip (FC), and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), preferred according to Industry Specifications (IPC)

6 soldering pastes; soft solder for use in the form of a printable paste for use in microelectronic applications, wherein the paste comprises powder having a particle size of less than 50 micrometers of tin, copper, zinc and silver; solder pastes for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the pastes comprise solder metal and its alloys and flux for use in printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronic industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes

2 conductive inks for use in wave soldering, THT-soldering, also known as through-hole technology-soldering, and SMD-soldering, also known as surface mounted technology soldering, wherein the inks comprising solder metal and its alloys and flux for printing of electronic components, in particular in the chip industry, semiconductor industry, consumer electronics industry and automotive industry; all of the above mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and not for soldering in the field of gas and water pipes

1 Chemical agents for use in soldering in the microelectronics industry; electronic-grade chemical agents for use in soldering in the microelectronics industry; chemical agents for use in screen printing, dispensing and jetting in soldering in the microelectronics industry; chemical agents for use in soldering in the microelectronics industry, namely, in the semiconductor industry; chemical agents for use in soldering in the microelectronics industry, namely, chemical agents for use in clean room applications; all the aforementioned goods preferably for use in chip-production, namely, as soldering preparations comprising solder metal alloys and flux, conductive inks comprising solder metal and its alloys and flux for use in surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of the metals; all the above mentioned goods preferably for use in chip-production, namely, electronic-grade chemical agents for use in soldering in the microelectronics industry for surface-mountable devices (SMD), surface-mountable technology (SMT), through-hole technology (THT), pin-in-hole technology (PIH), System in Package (SIP), System on-chip (SoC), monolithic integration in a semiconductor (IC), and electric circuits boards with pitches and line spacing from 100 nanometers up to 200 micrometers, in particular wherein the particles of the powder have a particle size of less than 50 micrometers, in particular comprising the metals tin, copper, zinc, bismuth and silver and an alloy of at least of two of these metals; all of the above-mentioned goods comprising tin; all the above-mentioned goods not for soldering of water pipes, copper pipes, gutters, jewelry and iron-containing components, and in the field of gas and water pipes

Trademark Events

Dec 26, 2023

Notice Of Registration Confirmation Emailed

Dec 26, 2023

Registered-Principal Register

Oct 10, 2023

Official Gazette Publication Confirmation E-Mailed

Oct 10, 2023

Published For Opposition

Sep 20, 2023

Notification Of Notice Of Publication E-Mailed

Sep 5, 2023

Approved For Pub - Principal Register

Sep 5, 2023

Examiner's Amendment Entered

Sep 5, 2023

Notification Of Examiners Amendment E-Mailed

Sep 5, 2023

Examiners Amendment E-Mailed

Sep 5, 2023

Examiners Amendment -Written

Jul 30, 2023

Notification Of Non-Final Action E-Mailed

Jul 30, 2023

Non-Final Action E-Mailed

Jul 30, 2023

Non-Final Action Written

Apr 17, 2023

Teas/Email Correspondence Entered

Apr 17, 2023

Correspondence Received In Law Office

Apr 17, 2023

Assigned To Lie

Jan 19, 2023

Teas Response To Office Action Received

Jul 25, 2022

Notification Of Non-Final Action E-Mailed

Jul 25, 2022

Non-Final Action E-Mailed

Jul 25, 2022

Non-Final Action Written

Jul 14, 2022

Assigned To Examiner

Nov 2, 2021

New Application Office Supplied Data Entered

Oct 14, 2021

New Application Entered