Trademark: 97041750
Status Date
Monday, July 24, 2023
Filing Date
Thursday, September 23, 2021
Published for Opposition
Tuesday, July 12, 2022
1 Chemicals used in metallization of circuit boards and integrated chips; chemicals used for plating through holes in electronic circuit boards; chemicals for plating high aspect ratio through holes and micro vias in circuit boards; direct metallization chemicals for use in high-density printed circuit boards; chemicals used in the manufacture of high density interconnect circuitry; chemicals used in metallization of printed circuit board substrates
Jul 25, 2023
Notice Of Approval Of Extension Request E-Mailed
Jul 24, 2023
Sou Extension 2 Granted
Jul 17, 2023
Sou Extension 2 Filed
Jul 24, 2023
Case Assigned To Intent To Use Paralegal
Jul 17, 2023
Sou Teas Extension Received
Jul 17, 2023
Teas Statement Of Use Received
Mar 7, 2023
Notice Of Approval Of Extension Request E-Mailed
Mar 3, 2023
Sou Extension 1 Granted
Mar 3, 2023
Sou Extension 1 Filed
Mar 3, 2023
Sou Teas Extension Received
Sep 6, 2022
Noa E-Mailed - Sou Required From Applicant
Jul 12, 2022
Official Gazette Publication Confirmation E-Mailed
Jul 12, 2022
Published For Opposition
Jun 22, 2022
Notification Of Notice Of Publication E-Mailed
Jun 6, 2022
Approved For Pub - Principal Register
May 28, 2022
Assigned To Examiner
Oct 25, 2021
New Application Office Supplied Data Entered
Sep 27, 2021
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
