Trademark: 90877083
Status Date
Thursday, February 1, 2024
Filing Date
Wednesday, August 11, 2021
Published for Opposition
Tuesday, July 26, 2022
17 Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing printed circuit boards; insulating resin materials for use in the process of producing electronic components; insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials for sealing electronic components; insulating resin materials for interlayer dielectric materials in the form of dry film for use in the process of producing build-up boards; insulating resin materials for interlayer dielectric materials in the form of dry film for sealing electronic components; insulating coating materials for use in the process of producing printed circuit boards; insulating coating materials for use in the process of producing display panels; insulating coating materials for protecting copper foil on the surface of printed circuit boards; insulating coating materials for use in the process of producing package application boards; insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, insulating materials for protecting copper foil used with holes of printed circuit boards; insulating materials for sealing electronic components; insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics; thermally conductive insulating resin materials for electronic components; insulating materials; electrical insulating materials
2 Dyes for general industrial use; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink
1 Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; etching resist; photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; dry films for electronic components; photosensitive resists in the form of film for sealing electronic components; insulation dry films for electronic components; thermal curing type dry films for electronic components; chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; heat resisting materials, namely, heat resisting unprocessed artificial resin for electronic components; chemical preparations for industrial purposes; industrial chemicals; glue and adhesives for industrial purposes; chemical preparations, namely, thermal interface materials for electronic components for use as a filler to enhance the thermal conductivity between components
Feb 3, 2024
Notice Of Approval Of Extension Request E-Mailed
Feb 1, 2024
Sou Extension 3 Granted
Feb 1, 2024
Sou Extension 3 Filed
Feb 1, 2024
Sou Teas Extension Received
Jan 2, 2024
Assigned To Examiner
Jul 28, 2023
Notice Of Approval Of Extension Request E-Mailed
Jul 26, 2023
Sou Extension 2 Granted
Jul 26, 2023
Sou Extension 2 Filed
Jul 26, 2023
Sou Teas Extension Received
Oct 11, 2022
Notice Of Approval Of Extension Request E-Mailed
Oct 7, 2022
Sou Extension 1 Granted
Oct 7, 2022
Sou Extension 1 Filed
Oct 7, 2022
Sou Teas Extension Received
Sep 20, 2022
Noa E-Mailed - Sou Required From Applicant
Jul 26, 2022
Official Gazette Publication Confirmation E-Mailed
Jul 26, 2022
Published For Opposition
Jul 6, 2022
Notification Of Notice Of Publication E-Mailed
Jun 17, 2022
Approved For Pub - Principal Register
Jun 9, 2022
Teas/Email Correspondence Entered
Jun 9, 2022
Correspondence Received In Law Office
Jun 9, 2022
Teas Response To Office Action Received
May 19, 2022
Notification Of Non-Final Action E-Mailed
May 19, 2022
Non-Final Action E-Mailed
May 19, 2022
Non-Final Action Written
May 11, 2022
Assigned To Examiner
Nov 9, 2021
Teas Change Of Correspondence Received
Nov 9, 2021
Teas Change Of Domestic Representatives Address
Nov 9, 2021
Attorney/Dom.Rep.Revoked And/Or Appointed
Nov 9, 2021
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Oct 8, 2021
Preliminary/Voluntary Amendment - Entered
Oct 7, 2021
Assigned To Lie
Sep 3, 2021
Teas Voluntary Amendment Received
Oct 2, 2021
New Application Office Supplied Data Entered
Aug 14, 2021
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
