Trademark: 90141687
Status Date
Tuesday, October 4, 2022
Registration Number
6867006
Registration Date
Tuesday, October 4, 2022
Filing Date
Thursday, August 27, 2020
Published for Opposition
Tuesday, December 15, 2020
1 Thermal heat sink compounds, namely, thermal paste for use in mounting semiconductor devices, processors, transistors, diodes, rectifiers, resistors, power supplies, and power converters; thermal heat sink compounds, namely, thermal paste for use in a thermal joint for any electronic apparatus where efficient cooling is desired
Oct 4, 2022
Notice Of Registration Confirmation Emailed
Oct 4, 2022
Registered-Principal Register
Sep 1, 2022
Notice Of Acceptance Of Statement Of Use E-Mailed
Aug 31, 2022
Allowed Principal Register - Sou Accepted
Aug 24, 2022
Statement Of Use Processing Complete
Aug 9, 2022
Use Amendment Filed
Aug 24, 2022
Case Assigned To Intent To Use Paralegal
Aug 9, 2022
Teas Statement Of Use Received
Feb 9, 2022
Notice Of Approval Of Extension Request E-Mailed
Feb 7, 2022
Sou Extension 2 Granted
Feb 7, 2022
Sou Extension 2 Filed
Feb 7, 2022
Teas Extension Received
Jul 21, 2021
Notice Of Approval Of Extension Request E-Mailed
Jul 19, 2021
Sou Extension 1 Granted
Jul 19, 2021
Sou Extension 1 Filed
Jul 19, 2021
Teas Extension Received
Feb 9, 2021
Noa E-Mailed - Sou Required From Applicant
Dec 15, 2020
Official Gazette Publication Confirmation E-Mailed
Dec 15, 2020
Published For Opposition
Nov 25, 2020
Notification Of Notice Of Publication E-Mailed
Nov 10, 2020
Approved For Pub - Principal Register
Nov 8, 2020
Assigned To Examiner
Sep 30, 2020
New Application Office Supplied Data Entered In Tram
Aug 31, 2020
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
