Trademark: 88806340
Status Date
Monday, October 10, 2022
Filing Date
Friday, February 21, 2020
Published for Opposition
Tuesday, July 14, 2020
Abandoned Date
Monday, October 10, 2022
7 Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
3 Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
1 Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA), and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (CMP) slurry and chemical mechanical planarization (CMP) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
The mark consists of a horizontal wavy line with a horizontal straight line bisecting the wavy line equally.
Color is not claimed as a feature of the mark.
Oct 11, 2022
Abandonment Notice E-Mailed - No Use Statement Filed
Oct 10, 2022
Abandonment - No Use Statement Filed
Jul 12, 2022
Teas Change Of Correspondence Received
Jul 12, 2022
Teas Withdrawal Of Attorney Received-Firm Retains
Jul 12, 2022
Attorney/Dom.Rep.Revoked And/Or Appointed
Jul 12, 2022
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Mar 18, 2022
Notice Of Approval Of Extension Request E-Mailed
Mar 17, 2022
Sou Extension 3 Granted
Mar 7, 2022
Sou Extension 3 Filed
Mar 17, 2022
Case Assigned To Intent To Use Paralegal
Mar 7, 2022
Sou Teas Extension Received
Sep 9, 2021
Notice Of Approval Of Extension Request E-Mailed
Sep 7, 2021
Sou Extension 2 Granted
Sep 7, 2021
Sou Extension 2 Filed
Sep 7, 2021
Sou Teas Extension Received
May 12, 2021
Automatic Update Of Assignment Of Ownership
Apr 13, 2021
Petition To Director Granted
Apr 13, 2021
Assigned To Petition Staff
Apr 13, 2021
Assigned To Petition Staff
Mar 5, 2021
Notice Of Approval Of Extension Request E-Mailed
Mar 3, 2021
Sou Extension 1 Granted
Mar 3, 2021
Sou Extension 1 Filed
Mar 3, 2021
Sou Teas Extension Received
Jan 26, 2021
Teas Petition To Director Received
Sep 8, 2020
Noa E-Mailed - Sou Required From Applicant
Jul 14, 2020
Official Gazette Publication Confirmation E-Mailed
Jul 14, 2020
Published For Opposition
Jun 24, 2020
Notification Of Notice Of Publication E-Mailed
Jun 8, 2020
Approved For Pub - Principal Register
May 28, 2020
Teas/Email Correspondence Entered
May 28, 2020
Correspondence Received In Law Office
May 28, 2020
Assigned To Lie
May 21, 2020
Teas Response To Office Action Received
May 19, 2020
Combined Examiner's Amendment/Priority Action Entered
May 19, 2020
Assigned To Lie
May 19, 2020
Notification Of Examiner's Amendment/Priority Action E-Mailed
May 19, 2020
Examiner's Amendment/Priority Action E-Mailed
May 19, 2020
Examiners Amendment And/Or Priority Action - Completed
May 11, 2020
Assigned To Examiner
Feb 27, 2020
Notice Of Design Search Code E-Mailed
Feb 26, 2020
New Application Office Supplied Data Entered
Feb 25, 2020
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24