Trademark: 88771443
Word
HIGH DENSITY VIA PATTERN (HDVP)
Status Date
Monday, November 1, 2021
Filing Date
Thursday, January 23, 2020
Abandoned Date
Wednesday, October 20, 2021
9 Printed circuit boards; electronic back panel assemblies, namely, graphics cards, video display cards, electronic circuit cards, all for use with personal computers and personal cellular telephones; electronic wire harnesses and custom electronic cable assemblies comprised of electric connectors, electrical adapters, connection cables, cable connectors and electrical connectors; and custom electronic enclosures, namely, cases for panel mounted, electronic instruments in the nature of logic analyzers
40 Manufacture of printed circuit boards, electronic backpanel assemblies, electronic wire harnesses, custom electronic cable assemblies, and custom electronic enclosures to order and/or specifications of others
HIGH DENSITY VIA PATTERN (HIGH DENSITY VIA PATTERN)
Nov 1, 2021
Abandonment Notice E-Mailed - Failure To Respond
Nov 1, 2021
Abandonment Notice Mailed - Failure To Respond
Nov 1, 2021
Abandonment - Failure To Respond Or Late Response
Sep 14, 2021
Assigned To Examiner
Apr 19, 2021
Notification Of Non-Final Action E-Mailed
Apr 19, 2021
Non-Final Action E-Mailed
Apr 19, 2021
Non-Final Action Written
Feb 5, 2021
Teas/Email Correspondence Entered
Feb 5, 2021
Correspondence Received In Law Office
Feb 3, 2021
Assigned To Lie
Oct 28, 2020
Teas Response To Office Action Received
Apr 28, 2020
Notification Of Non-Final Action E-Mailed
Apr 28, 2020
Non-Final Action E-Mailed
Apr 28, 2020
Non-Final Action Written
Apr 11, 2020
Assigned To Examiner
Jan 28, 2020
New Application Office Supplied Data Entered In Tram
Jan 27, 2020
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
