Trademark: 88738111
Status Date
Tuesday, June 29, 2021
Filing Date
Monday, December 23, 2019
Abandoned Date
Wednesday, April 14, 2021
9 High-lead, tin-lead, tin-based, or copper-wrapped solder columns sold as an integral component of integrated circuits and circuit boards
Jun 29, 2021
Abandonment Notice Mailed - Incomplete Response
Jun 29, 2021
Abandonment - Incomplete Response
Jun 17, 2021
Teas/Email Correspondence Entered
Jun 17, 2021
Correspondence Received In Law Office
Jun 16, 2021
Assigned To Lie
Mar 29, 2021
Teas Request For Reconsideration Received
Oct 13, 2020
Notification Of Final Refusal Emailed
Oct 13, 2020
Final Refusal E-Mailed
Oct 13, 2020
Final Refusal Written
Sep 22, 2020
Teas/Email Correspondence Entered
Sep 21, 2020
Correspondence Received In Law Office
Sep 21, 2020
Teas Response To Office Action Received
Mar 23, 2020
Notification Of Non-Final Action E-Mailed
Mar 23, 2020
Non-Final Action E-Mailed
Mar 23, 2020
Non-Final Action Written
Mar 19, 2020
Assigned To Examiner
Jan 7, 2020
Teas Amendment Entered Before Attorney Assigned
Jan 7, 2020
Teas Voluntary Amendment Received
Jan 2, 2020
New Application Office Supplied Data Entered In Tram
Dec 26, 2019
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24