Trademark: 88719666
Word
CMC MATERIALS
Status Date
Tuesday, March 8, 2022
Registration Number
6667339
Registration Date
Tuesday, March 8, 2022
Filing Date
Monday, December 9, 2019
Published for Opposition
Tuesday, May 26, 2020
7 Non-abrasive polishing pads for chemical-mechanical planarizing or chemical mechanical polishing (cmp) machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers, integrated circuits, hard disk drives and chipsets; Polishing pads for use in the manufacture of advanced integrated circuit devices within the semiconductor industry
3 Industrial abrasives, namely, abrasive compounds for lapping and polishing semiconductors, silicon wafers, glass and metal surfaces; Chemical cleaner directed to the electronics industry; Post-copper chemical mechanical planarization (cmp) cleaning solution for use in the manufacturing and processing of semiconductors; Chemical cleaning solution for processing of integrated circuit (ic) in the opto-electronics and photonics industries; Post-ash cleaning solution for use in the manufacturing and processing of semiconductors; Abrasive preparations, namely, chemical cleaners, namely, abrasive dispersion slurries and cleaning and polishing preparations for use in the finishing of electronic components and substrates, optical components, glass, metals, plastics, machinery, computer parts, magnetic data-storage disks and heads
1 Chemical slurry for polishing semiconductors; Chemical slurries for polishing semiconductors, silicon wafers, glass, metals, plastics, machinery, electronic components and substrates, optical components, computer parts, magnetic data-storage disks and heads for use in the semiconductor, electronic, rigid disk and magnetic head industries; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth, or otherwise modify their chemical-mechanical properties; Chemical slurries for polishing semiconductors used for the treatment of semiconductors to planarize, smooth or otherwise modify their mechanical, physical, chemical and electrical properties; Chemical solutions for use in the manufacturing and processing of semiconductors, namely, photoresist stripper, benzotriazole (BTA) and L-proline solution; Fumed silica dispensed in water used to polish semiconductors; Aqueous metal oxide dispersions for use in semiconductor polishing; Chemical additives, namely, abrasive dispersions for use in the manufacture of electronic components and substrates, optical components, metals, machinery, computer parts, and magnetic data-storage disks and heads; Chemical slurries for use in the manufacture of advanced integrated circuit devices within the semi-conductor industry; High purity chemical compositions for electronic component manufacture; Chemical compositions for use in semiconductor manufacturing, solar cell panel manufacturing and flat panel display manufacturing; Chemical compositions for removal of photoresist and post-etch residues in the manufacture of semiconductors, integrated circuits and related products; Chemicals for use in industry and science; Chemical preparations for use in industry and science, namely, for use in the semiconductor and micro-electronics industries; Chemical mechanical polishing (cmp) slurry and chemical mechanical planarization (cmp) slurry for use in the manufacturing and processing of semiconductors in the optoelectronics and photonics industries
The mark consists of horizontal wavy line with a horizontal straight line bisecting the wavy line equally to the left of the words "CMC MATERIALS".
CABOT MICROELECTRONICS CORPORATION MATERIALS
Color is not claimed as a feature of the mark.
"MATERIALS"
Oct 18, 2023
Automatic Update Of Assignment Of Ownership
Aug 9, 2023
Teas Change Of Correspondence Received
Aug 9, 2023
Attorney/Dom.Rep.Revoked And/Or Appointed
Aug 9, 2023
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Aug 9, 2023
Applicant/Correspondence Changes (Non-Responsive) Entered
Aug 9, 2023
Teas Change Of Owner Address Received
Mar 8, 2022
Registered-Principal Register
Feb 2, 2022
Notice Of Acceptance Of Statement Of Use E-Mailed
Feb 1, 2022
Allowed Principal Register - Sou Accepted
Feb 1, 2022
Notice Of Approval Of Extension Request E-Mailed
Jan 31, 2022
Statement Of Use Processing Complete
Jan 21, 2022
Use Amendment Filed
Jan 31, 2022
Sou Extension 3 Granted
Jan 21, 2022
Sou Extension 3 Filed
Jan 31, 2022
Case Assigned To Intent To Use Paralegal
Jan 21, 2022
Sou Teas Extension Received
Jan 21, 2022
Teas Statement Of Use Received
Jul 23, 2021
Notice Of Approval Of Extension Request E-Mailed
Jul 21, 2021
Sou Extension 2 Granted
Jul 21, 2021
Sou Extension 2 Filed
Jul 21, 2021
Sou Teas Extension Received
May 12, 2021
Automatic Update Of Assignment Of Ownership
Apr 3, 2021
Petition To Director Granted
Apr 13, 2021
Assigned To Petition Staff
Apr 13, 2021
Assigned To Petition Staff
Jan 15, 2021
Notice Of Approval Of Extension Request E-Mailed
Jan 13, 2021
Sou Extension 1 Granted
Jan 13, 2021
Sou Extension 1 Filed
Jan 13, 2021
Sou Teas Extension Received
Jan 13, 2021
Teas Petition To Director Received
Jul 21, 2020
Noa E-Mailed - Sou Required From Applicant
May 26, 2020
Official Gazette Publication Confirmation E-Mailed
May 26, 2020
Published For Opposition
May 6, 2020
Notification Of Notice Of Publication E-Mailed
Apr 22, 2020
Assigned To Lie
Apr 14, 2020
Approved For Pub - Principal Register
Apr 13, 2020
Teas/Email Correspondence Entered
Apr 13, 2020
Correspondence Received In Law Office
Apr 13, 2020
Teas Response To Office Action Received
Feb 25, 2020
Notification Of Non-Final Action E-Mailed
Feb 25, 2020
Non-Final Action E-Mailed
Feb 25, 2020
Non-Final Action Written
Feb 25, 2020
Non-Final Action Written
Feb 25, 2020
Non-Final Action Written
Feb 24, 2020
Notification Of Non-Final Action E-Mailed
Feb 24, 2020
Non-Final Action E-Mailed
Feb 24, 2020
Non-Final Action Written
Feb 24, 2020
Assigned To Examiner
Dec 13, 2019
Notice Of Design Search Code E-Mailed
Dec 12, 2019
New Application Office Supplied Data Entered
Dec 12, 2019
New Application Entered
Trademark Alertz updated from USPTO on 2030-01-24
