Trademark: 88235684
Word
HITECH
Status
Pending
Status Code
645
Status Date
Thursday, October 17, 2019
Serial Number
88235684
Mark Type
4000
Filing Date
Wednesday, December 19, 2018

Trademark Owner History

Classifications
1 adhesives for use in electronics industry; non-conductive adhesives for use in electronics industry; unprocessed epoxy resins for use in electronics industry; industrial adhesives used in the assembly, maintenance and repair of electronics for use in electronics industry; fillers for use with electronic components, namely, unprocessed epoxy resins for use as underfill; unprocessed epoxy resins; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for bonding, wetproofing, coating, encapsulation, sealing, molding, waterproofing, moisture proofing, heatproofing, solder joint attachment applications in the electronics industry; industrial adhesives, unprocessed artificial resins, unprocessed synthetic resins, and unprocessed epoxy resins for use in the electronics industry
HI TECH

Trademark Events
Oct 17, 2019
Notification Of Final Refusal Emailed
Oct 17, 2019
Final Refusal E-Mailed
Oct 17, 2019
Final Refusal Written
Sep 25, 2019
Teas/Email Correspondence Entered
Sep 25, 2019
Correspondence Received In Law Office
Sep 25, 2019
Teas Response To Office Action Received
Mar 25, 2019
Notification Of Non-Final Action E-Mailed
Mar 25, 2019
Non-Final Action E-Mailed
Mar 25, 2019
Non-Final Action Written
Mar 14, 2019
Assigned To Examiner
Jan 13, 2019
New Application Office Supplied Data Entered In Tram
Dec 22, 2018
New Application Entered In Tram

Trademark Alertz updated from USPTO on 2030-01-24