Trademark: 87203504
Word
HP2I
Status Date
Tuesday, April 3, 2018
Filing Date
Friday, October 14, 2016
Abandoned Date
Thursday, March 1, 2018
9 Large scale integrated circuits (LSI); Semi-conductors; Semiconductor elements; Semi-conductor wafers; Wafers; Electronic semi-conductors; Electronic integrated circuits; Electronic circuit board; Connectors for electronic circuits; Integrated circuits; Circuit boards provided with integrated circuits; Integrated circuit module; Chips (integrated circuits); Transistors; Printed circuits; Circuit boards; Integrated circuits for use in digital signal processors (dsp); Simulator for semiconductor; Computer software for use in processing semiconductor wafers; Semiconductor component
Color is not claimed as a feature of the mark.
The mark consists of the letters "HP" followed by the numeral "2" appearing in superscript followed by the letter "I".
Apr 3, 2018
Abandonment Notice Mailed - Failure To Respond
Apr 3, 2018
Abandonment - Failure To Respond Or Late Response
Aug 29, 2017
Notification Of Inquiry As To Suspension E-Mailed
Aug 29, 2017
Inquiry To Suspension E-Mailed
Aug 29, 2017
Suspension Inquiry Written
Aug 9, 2017
Lie Checked Susp - To Atty For Action
Aug 9, 2017
Assigned To Lie
Jan 26, 2017
Notification Of Letter Of Suspension E-Mailed
Jan 26, 2017
Letter Of Suspension E-Mailed
Jan 26, 2017
Suspension Letter Written
Jan 25, 2017
Assigned To Examiner
Oct 19, 2016
New Application Office Supplied Data Entered In Tram
Oct 18, 2016
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
