Trademark: 86185667
Word
MRSI
Status Date
Saturday, October 26, 2019
Registration Number
4597126
Registration Date
Tuesday, September 2, 2014
Filing Date
Wednesday, February 5, 2014
Published for Opposition
Tuesday, June 17, 2014
7 Die bonders used in manufacturing electronic components; machines for mounting microchips, semiconductor chips, semiconductor components and electronic components; adhesive chemical dispensing machines; high precision dispense and assembly equipment for the semiconductor, advanced packaging and microelectronics industry; laser doping, laser scribing and laser disk texturing machines
Feb 8, 2014
New Application Entered
Sep 13, 2019
Teas Change Of Correspondence Received
Feb 18, 2014
New Application Office Supplied Data Entered
May 12, 2014
Assigned To Examiner
May 13, 2014
Approved For Pub - Principal Register
May 28, 2014
Notification Of Notice Of Publication E-Mailed
Jun 17, 2014
Published For Opposition
Jun 17, 2014
Official Gazette Publication Confirmation E-Mailed
Sep 2, 2014
Registered-Principal Register
Sep 2, 2019
Courtesy Reminder - Sec. 8 (6-Yr) E-Mailed
Sep 13, 2019
Teas Section 8 & 15 Received
Oct 26, 2019
Case Assigned To Post Registration Paralegal
Oct 26, 2019
Registered - Sec. 8 (6-Yr) Accepted & Sec. 15 Ack.
Oct 26, 2019
Notice Of Acceptance Of Sec. 8 & 15 - E-Mailed
Sep 2, 2023
Courtesy Reminder - Sec. 8 (10-Yr)/Sec. 9 E-Mailed
Aug 8, 2024
Teas Section 8 & 9 Received
Trademark Alertz updated from USPTO on 2030-01-24
