Trademark: 85823352
Status Date
Monday, August 31, 2015
Filing Date
Tuesday, January 15, 2013
Published for Opposition
Tuesday, June 4, 2013
Abandoned Date
Monday, August 31, 2015
9 Printed circuit boards; chip scale packaging, namely, semiconductor packaging for manufacturers of semiconductors and electronic components, semiconductor packaging for manufacturers of systems and devices utilizing semiconductors in the nature of dies, substrates, interposers, wire bond and solder bumps, semiconductor packaging for manufacturers of circuitized lead frames and semiconductor packaging for manufacturers of circuit boards used to protect integrated circuits from contaminants, moisture, and mechanical damage and to provide for electrical connections to and from the integrated circuit
Aug 31, 2015
Abandonment Notice Mailed - No Use Statement Filed
Aug 31, 2015
Abandonment - No Use Statement Filed
Jan 31, 2015
Notice Of Approval Of Extension Request E-Mailed
Jan 29, 2015
Extension 3 Granted
Jan 29, 2015
Extension 3 Filed
Jan 29, 2015
Teas Extension Received
Jul 26, 2014
Notice Of Approval Of Extension Request E-Mailed
Jul 24, 2014
Extension 2 Granted
Jul 24, 2014
Extension 2 Filed
Jul 24, 2014
Teas Extension Received
Jan 4, 2014
Notice Of Approval Of Extension Request E-Mailed
Jan 2, 2014
Extension 1 Granted
Jan 2, 2014
Extension 1 Filed
Jan 2, 2014
Teas Extension Received
Jul 30, 2013
Noa E-Mailed - Sou Required From Applicant
Jun 4, 2013
Official Gazette Publication Confirmation E-Mailed
Jun 4, 2013
Published For Opposition
May 15, 2013
Notification Of Notice Of Publication E-Mailed
Apr 29, 2013
Law Office Publication Review Completed
Apr 29, 2013
Approved For Pub - Principal Register
Apr 29, 2013
Assigned To Examiner
Jan 30, 2013
Applicant Amendment Prior To Examination - Entered
Jan 24, 2013
Assigned To Lie
Jan 22, 2013
Teas Voluntary Amendment Received
Jan 23, 2013
Notice Of Pseudo Mark Mailed
Jan 22, 2013
New Application Office Supplied Data Entered In Tram
Jan 18, 2013
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
