Trademark: 85779168
Word
LBSEMICON
Status Date
Monday, August 18, 2014
Filing Date
Wednesday, November 14, 2012
Published for Opposition
Tuesday, November 19, 2013
Abandoned Date
Monday, August 18, 2014
9 Semiconductors, Flip-chip bumping, namely, conductive bumps to be applied to the surface of electronic chips to provide an electrical connection, Electronic Chip for the manufacture of integrated circuits, electronic apparatus for testing wafer level, electronic apparatus for testing chip level, electronic integrated circuits for use in the display of LCD TV, OLED TV, PDP, tablet PC, mobile phone
Color is not claimed as a feature of the mark.
The mark consists of "LBSemicon" in stylized letters with "LB" in bold.
LB SEMICON
Aug 18, 2014
Abandonment Notice Mailed - No Use Statement Filed
Aug 18, 2014
Abandonment - No Use Statement Filed
Jan 14, 2014
Noa E-Mailed - Sou Required From Applicant
Nov 19, 2013
Official Gazette Publication Confirmation E-Mailed
Nov 19, 2013
Published For Opposition
Oct 30, 2013
Notification Of Notice Of Publication E-Mailed
Oct 15, 2013
Law Office Publication Review Completed
Oct 14, 2013
Approved For Pub - Principal Register
Sep 25, 2013
Teas/Email Correspondence Entered
Sep 25, 2013
Correspondence Received In Law Office
Sep 18, 2013
Teas Response To Office Action Received
Mar 18, 2013
Notification Of Non-Final Action E-Mailed
Mar 18, 2013
Non-Final Action E-Mailed
Mar 18, 2013
Non-Final Action Written
Mar 11, 2013
Assigned To Examiner
Dec 7, 2012
Applicant Amendment Prior To Examination - Entered
Nov 28, 2012
Assigned To Lie
Nov 20, 2012
Teas Voluntary Amendment Received
Nov 21, 2012
Notice Of Pseudo Mark Mailed
Nov 20, 2012
New Application Office Supplied Data Entered In Tram
Nov 17, 2012
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
