42 Development of printed circuit boards; assembly and testing of printed circuit boards and semiconductors; electronic computer systems integration for high performance computing (HPC), art and design (A and D), automated test equipment (ATE), medical, imaging, telecomm, microwave, and industrial markets; semiconductor assembly and test services; advanced laboratory and engineering services, namely, reliability engineering, material science, and failure analysis, thermal and mechanical modeling, product qualifications testing, and mechanical and fragility testing; gamma-ray spectroscopy testing, special nuclear material identification, research in the field of health physics, geological research in the nature of site monitoring; gamma-ray spectroscopy testing, and industrial gauging in the nature of calibration of nuclear density gauges; lab spectroscopy testing, non-medical x-ray imaging, detector development activities, namely, detection of radiation and/or explosive devices; liquid level gauging, fill level gauging, and web/thickness gauging, namely, gauge calibration; x-ray inspection of physical features, case inspection of physical features; developing and designing services for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; developing, designing and testing for others of printed circuit boards and electronic components for use with printed circuit boards, namely, capacitors, resistors, inductors, coils, diodes, transistors, integrated circuits, chip carriers, connectors, sockets, switches, crystals, relays, jumpers, thermistors, optoelectronics, modules, dual inline packages consisting of capacitors, resistors, diodes and transistors, and card-on-board assemblies; reliability engineering services, thermal and mechanical modeling services for printed circuit boards and components for use with printed circuit boards, semiconductor substrate and packaging materials, and wearable medical diagnostic and therapeutic devices