Trademark: 79400173
Word
TORYZA
Status Date
Friday, September 20, 2024
Filing Date
Monday, March 4, 2024
7 Surface treatment equipment for use in the manufacture of semi-conductors; semiconductor manufacturing machines; machines for manufacturing semi-conductors; plating machines for use in the manufacture of semi-conductors; surface treatment equipment for semiconductor wafers and integrated-circuits; semi-conductor substrates manufacturing machines; semiconductor wafer processing machines; etching machines and equipment for semiconductor substrates; plating machines; processing tanks for plating being parts of machines; chemical processing tanks being parts of machines; machines and equipment for use in manufacturing and processing electronic circuit printed boards; apparatus for machining; electroplating apparatus.
1 Chemicals for use in the manufacture of semiconductors; surface treatment agents for electronic components; etchants for use in the manufacture of semi-conductors; plating removing preparations; release solvent for photoresists; chemicals for use in metal plating; industrial chemicals; chemicals for use in plating; plating preparations; plating solutions; plating solution additives; metal surface treatment agents; chemicals for use in metal surface treatment; chemicals for metal industries; catalytic agents; catalysts; ungluing preparations; etching agents.
Jul 18, 2024
Sn Assigned For Sect 66a Appl From Ib
Jul 25, 2024
New Application Office Supplied Data Entered
Jul 25, 2024
Application Filing Receipt Mailed
Sep 18, 2024
Non-Final Action Written
Sep 18, 2024
Assigned To Examiner
Sep 19, 2024
Non-Final Action (Ib Refusal) Prepared For Review
Sep 20, 2024
Non-Final Action Mailed - Refusal Sent To Ib
Sep 20, 2024
Refusal Processed By Mpu
Trademark Alertz updated from USPTO on 2030-01-24
