Word

SILANNA SAFE UV

Status

Pending

Status Code

641

Status Date

Saturday, April 27, 2024

Serial Number

79381747

Mark Type

4

Filing Date

Wednesday, August 9, 2023

Trademark Owner History

Silanna Semiconductor Pty Ltd

Classifications

40 Customised materials assembly for others; custom manufacture of chips; custom manufacture of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; custom manufacture services for others in the field of semiconductor devices; providing semiconductor material treatment information; technical support services, namely, providing technical advice related to the custom manufacture of semiconductor materials and devices; consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing

9 Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments; apparatus and instruments for conducting, switching, transforming, accumulating, regulating or controlling electricity; apparatus for recording, transmission or reproduction of sound or images; magnetic data carriers, recording discs; mechanisms for coin-operated apparatus; cash registers, calculating machines, fire-extinguishing apparatus; circuits; analog circuits; digital and analog signalling devices; high speed isolators; wide band receivers; low noise amplifiers; electronic circuits; electronic integrated circuits; electronic logic circuits; electronic memory circuits; hybrid circuits; hybrid integrated circuits; infrared circuit components; logic circuits; masks for making circuits; microprocessor control circuits; miniature circuit breakers; circuit breakers; circuit cards; circuit closers; circuit distributors; circuit fuses; circuit openers; circuit switches; circuit testers; circuits (electric or electronic); electronic chips (semi-conductors) for the manufacture of integrated circuits; integrated circuits; cards bearing integrated circuits; cards incorporating integrated circuits; cartridges with memory integrated circuits; chips (integrated circuits); silicon on insulator wafers; glass wafers for integrated circuits; integrated circuits for networks for use in identification; masks for making integrated circuits; masks for the production of integrated circuits; photo mask substrates for integrated circuits; plates with integrated circuits; probes for use with integrated circuits (other than for medical use); reading machines for integrated circuits; silicon wafer carriers for handling integrated circuits; sockets for testing integrated circuits; solid-state integrated circuits; test probe assemblies for integrated circuits; test sockets for integrated circuits; thick film hybrid integrated circuits; integrated circuit memories; semi conductors; complementary metal-oxide semiconductors; compound semiconductors; semi conductor memories; semi conductor chips; semi conductor and microprocessor cartridges; semiconductor apparatus; semiconductor apparatus for use with computers; semiconductor devices; semiconductor elements; semiconductor instruments; semiconductor memories; computer programmes; semiconductor memory apparatus; semiconductor memory units; computer programmes; semiconductor memory devices; semiconductor memory instruments; semiconductor wafers; semiconductors (integrated circuits); semiconductors being electronic devices; silicon chips (electronic components); silicon controlled reactors; silicon controlled rectifiers; micro accelerometers; silicon micro accelerometers; silicon rubber layered electrical connectors; silicon slices (wafers); silicon wafer slices; silicon wafers; wafers (silicon slices); processors; microprocessors; microcontrollers; static RAM; digital logic circuits; equipment for testing and programming integrated circuits; catalyst substrates for use in signalling apparatus; flexible circuit substrates having controlled impedance characteristics; flexible printed circuits incorporating substrates; glass substrates for magnetic recording media; photomask substrates for integrated circuits; printed circuits on substrates of flexible film; printed circuits on substrates of plastics material; printed substrates for printed circuit boards; recording substrates (magnetic); recording substrates (optical); special glass carrier substrates for biologically significant substances for magnetic recording devices; substrates (printed circuit boards) ready for etching; substrates (wafers); substrates for carrying information in electronic form; substrates for carrying information in magnetic form; substrates for carrying information in optical form; substrates for holographs; substrates for photographs (exposed); substrates for photographs (unexposed); apparatus for connecting electrical circuit components; apparatus for testing electronic circuits; apparatus for testing printed circuit boards; apparatus for the exposure of films for integrated circuits; light emitting diodes (LED); light emitting diodes (LED) for use in scientific and manufacturing equipment; light emitting diodes (LED) for high energy light; parts, fittings, accessories, components and testing apparatus for all the aforesaid goods

42 Scientific and technological services and research and design relating thereto; industrial analysis and research services; research, engineering, design and development of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; foundry services related to design of semi-conductors, circuits, integrated circuits, microprocessors, complementary metal-oxide semiconductors, compound semiconductors, silicon chips, silicon wafers and processors; engineering project management services; management of scientific research projects; project management (design); research, engineering, design and development of microelectronic devices; design services for others; design of electric circuit boards; analysis of materials; industrial analysis; laboratory services; laboratory services (scientific research or analysis); materials characterisation analysis; technological engineering analysis; technological analysis services; scientific and technical analysis; engineering project management of testing, packaging and assembly services; prototype design services; research, engineering, design and development of light emitting diodes (LED); testing of semiconductor materials and devices; technical project research of semiconductor materials and devices; research and development of semiconductor materials and devices; engineering service in the field of semiconductor materials and devices; packaging design; contract foundry design, testing and engineering support services in the field of semiconductor materials and devices; foundry services related to design of light emitting diodes (LED); consultancy, assistance, advisory and information services (including online, interactive, digital and datacasting services) in relation to the foregoing

Trademark Events

Oct 27, 2023

New Application Office Supplied Data Entered

Oct 26, 2023

Sn Assigned For Sect 66a Appl From Ib

Oct 31, 2023

Application Filing Receipt Mailed

Apr 15, 2024

Non-Final Action Written

Apr 16, 2024

Non-Final Action (Ib Refusal) Prepared For Review

Apr 27, 2024

Non-Final Action Mailed - Refusal Sent To Ib

May 22, 2024

Refusal Processed By Ib

Apr 27, 2024

Refusal Processed By Mpu

Apr 10, 2024

Assigned To Examiner