Word

CELLFIL

Status

Registered

Status Code

700

Status Date

Tuesday, May 31, 2022

Serial Number

79313789

Registration Number

6741699

Registration Date

Tuesday, May 31, 2022

Mark Type

4000

Filing Date

Monday, February 22, 2021

Published for Opposition

Tuesday, March 15, 2022

Trademark Owner History

TAIYO HOLDINGS CO., LTD. - Original Registrant

Classifications

17 Electrical insulating resists, namely, electrical insulating materials in the liquid form for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating resin materials for use in the process of producing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the liquid form for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for use in the process of producing build-up boards; electrical insulating materials, namely, insulating resin materials for interlayer dielectric materials in the form of film for sealing electronic components; electrical insulating materials, namely, insulating coating materials for use in the process of producing printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing display panels; electrical insulating materials, namely, insulating coating materials for protecting copper foil on the surface of printed circuit boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing package application boards; electrical insulating materials, namely, insulating coating materials for use in the process of producing flexible printed circuit boards; insulating fillers, namely, electrical insulating materials for protecting copper foil used with holes of printed circuit boards; electrical insulating materials for sealing electronic components; electrical insulating materials, namely, insulating resin materials for sealing electronic components; electrical insulating materials for use in the process of producing printed circuit boards; semi-processed plastics

2 Dyes, namely, synthetic dyes; pigments; paints for blocking light; marking inks in the nature of printing inks for use in the process of producing printed circuit boards; marking inks being printing inks for use in the process of producing electronic components; inks for hole plugging, namely, printing inks for use in the process of producing printed circuit boards; paints for sealing electronic components; heat-resistant paints; paints; printing inks for use in the process of producing printed circuit boards; printing inks for use in the process of producing electronic components; printing ink

1 Chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of solder mask; chemicals for use in the process of producing printed circuit boards, namely, resist ink in the nature of photoresists; chemicals for use in the process of producing printed circuit boards, namely, solder resists; chemical preparations for use in the process of producing printed circuit boards, namely, solder mask; chemicals for use in the process of producing printed circuit boards, namely, etching resist; chemicals for use in the process of producing printed circuit boards, namely, photoresists; chemical preparations for use in photography; photosensitive resists in the nature of solder mask in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the nature of photoresists in the form of film for use in the process of producing printed circuit boards; photosensitive resists in the form of film for sealing electronic components; unexposed dry films, namely, mold dry films for electronic components; unexposed dry films, namely, insulation mold dry films for electronic components; unexposed dry films, namely, thermal curing type mold dry films for electronic components; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light in the color of black in the form of paste for use in the process of forming of black matrix; chemicals for use in the process of producing printed circuit boards, namely, chemical preparations for blocking light; chemical coatings for use in the process of producing printed circuit boards; chemical coatings used in the manufacture of printed circuit boards; chemicals for use in the process of producing printed circuit boards, namely, chemical agents for plugging holes on printed circuit boards; chemical sealants for use in the process of producing electronic components; synthetic resins that are used as sealants for use in the process of producing electronic components; chemical preparations for industrial purposes; industrial chemicals; conductive adhesives for industrial purposes; glue and adhesives for industrial purposes

Trademark Events

Sep 15, 2022

Final Disposition Notice Sent To Ib

Sep 15, 2022

Final Disposition Processed

Aug 31, 2022

Final Disposition Notice Created, To Be Sent To Ib

Jul 9, 2022

Change Of Name/Address Rec'd From Ib

May 31, 2022

Notice Of Registration Confirmation Emailed

May 31, 2022

Registered-Principal Register

Mar 21, 2022

Notification Processed By Ib

Mar 15, 2022

Official Gazette Publication Confirmation E-Mailed

Mar 15, 2022

Published For Opposition

Feb 23, 2022

Notification Of Possible Opposition Sent To Ib

Feb 23, 2022

Notice Of Start Of Opposition Period Created, To Be Sent To Ib

Feb 23, 2022

Notification Of Notice Of Publication E-Mailed

Feb 14, 2022

Teas Change Of Correspondence Received

Feb 14, 2022

Attorney/Dom.Rep.Revoked And/Or Appointed

Feb 14, 2022

Teas Revoke/App/Change Addr Of Atty/Dom Rep Received

Feb 9, 2022

Approved For Pub - Principal Register

Feb 9, 2022

Teas/Email Correspondence Entered

Feb 9, 2022

Correspondence Received In Law Office

Feb 9, 2022

Teas Response To Office Action Received

Nov 5, 2021

Refusal Processed By Ib

Oct 12, 2021

Non-Final Action Mailed - Refusal Sent To Ib

Oct 12, 2021

Refusal Processed By Mpu

Sep 25, 2021

Non-Final Action (Ib Refusal) Prepared For Review

Sep 24, 2021

Non-Final Action Written

Sep 16, 2021

Assigned To Examiner

Aug 5, 2021

Correction From Ib Entered - No Review Required

Jul 31, 2021

Correction Transaction Received From Ib

Jul 6, 2021

Application Filing Receipt Mailed

Jun 30, 2021

New Application Office Supplied Data Entered In Tram

Jun 28, 2021

Limitation From Original Application Entered

Jun 24, 2021

Sn Assigned For Sect 66a Appl From Ib