9 Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semiconductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables