Trademark: 79204687
Word
SOITEC
Status Date
Tuesday, September 18, 2018
Registration Number
5563066
Registration Date
Tuesday, September 18, 2018
Filing Date
Wednesday, November 30, 2016
Published for Opposition
Tuesday, July 3, 2018
40 Treatment of materials by means of annealing, thermal annealing, rapid thermal annealing, laser annealing, oxidation, implantation for layer exfoliation, grinding, chemical and physical layer deposition in the nature of electrophoretic coating services, epitaxy, and bonding of material for layer transfer; Treatment of substrates by means of glass substrate polishing, grinding, chemical treatment of surface to remove particles and/or contaminants, laser irradiation, plasma treatment in the nature of applying plasma finishes, amorphization, re-crystallization, etching, chemical etching, plasma etching, carbonization, smoothing by means of plasma, heat treatment, plasma activation to hydrophilize surfaces, and hydrophilization for micro-electronics, opto-electronics, piezoelectric, photovoltaics, microsystems and radio frequency (RF) components; treatment of semiconductor wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of semiconductor wafers, transfer of layer by exfoliation; treatment of silicon wafers and semiconductors by means of laser beams, plasma in the nature of applying plasma finishes, annealing, and chemical treatment of surface to remove particles and/or contaminants; polishing of silicon wafers and semiconductors, transfer of layer by exfoliation
9 Semiconductor substrates for opto-electronics, micro-electronics, and micro-engineering, namely, semiconductor chips, integrated circuits, transistors, capacitors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories; semi-conductor wafers; semi-conductors; silicon wafers and semiconductors for integrated circuits and derived activities; semiconductor wafers for light-emitting diodes, radio frequency (RF) components and for power components; substrates for micro-electronics, opto-electronics, micro-engineering, light-emitting diodes, micro-systems, photovoltaics, integrated optical guides, sensors, integrated circuits, radio frequency (RF) and power components, namely, semiconductor chips, integrated circuits, transistors, capacitors, cable connectors, filters for radiofrequency bandwidth selection, oscillators, electric switches, electric resistors, amplifiers, and electronic memories
42 Scientific, technological, technical and industrial research in the field of material science for micro-electronics, opto-electronics, piezo electronics and micro-engineering, photovoltaics, microsystems and radio frequency (RF) components provided by engineers; testing of materials; laboratory work for others, namely, materials testing and scientific research and development; research and development of new products for others; scientific research and development in the field of wafers and semiconductors for opto-electronic and piezo electronics components, photovoltaics, radio frequency (RF) components, power components, micro-engineering, and micro-systems; scientific research and development in the field of silicon wafers and semiconductors for integrated circuits and derived activities; scientific research and development in the field of the transfer of micro-electronic circuits or micro-systems on all media; engineering and engineering services in the field of semiconductor wafers and semiconductors for micro-electronic, opto-electronic, piezo-electronic radio frequency (RF), micro-mechanical, photovoltaic components, memories, power components; engineering and engineering services in the field of silicon wafers and semiconductors for integrated circuits and derived activities and the transfer of micro-electronic or opto-electronic circuits or micro-systems on all types of media; research for the development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, memories, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems; assistance and technical support, namely, technical advice in the field of development of new products in the field of semiconductor wafers for the manufacture of electronic devices, for the manufacture of transistors, diodes, photodiodes, light-emitting diodes, photodiode detectors, radio frequency (RF) components and micro-systems
The mark consists of the stylized word "SOITEC" appearing in black font with the "O" formed by three ovals with pointed ends. The ovals are blue, green, and black. The color grey represents background and is not a feature of the mark.
The color(s) black, blue, and green is/are claimed as a feature of the mark.
Jan 16, 2024
Teas Change Of Correspondence Received
Jan 16, 2024
Attorney/Dom.Rep.Revoked And/Or Appointed
Jan 16, 2024
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Sep 18, 2023
Courtesy Reminder - Sec. 71 (6-Yr) E-Mailed
Jan 17, 2019
Final Decision Transaction Processed By Ib
Dec 29, 2018
Final Disposition Notice Sent To Ib
Dec 29, 2018
Final Disposition Processed
Dec 18, 2018
Final Disposition Notice Created, To Be Sent To Ib
Dec 6, 2018
New Representative At Ib Received
Sep 18, 2018
Registered-Principal Register
Jul 6, 2018
Notification Processed By Ib
Jul 3, 2018
Official Gazette Publication Confirmation E-Mailed
Jul 3, 2018
Published For Opposition
Jun 20, 2018
Notification Of Possible Opposition Sent To Ib
Jun 20, 2018
Notice Of Start Of Opposition Period Created, To Be Sent To Ib
Jun 13, 2018
Notification Of Notice Of Publication E-Mailed
May 29, 2018
Approved For Pub - Principal Register
May 21, 2018
Teas/Email Correspondence Entered
May 21, 2018
Correspondence Received In Law Office
May 18, 2018
Assigned To Lie
May 11, 2018
Teas Request For Reconsideration Received
May 11, 2018
Ex Parte Appeal-Instituted
May 11, 2018
Jurisdiction Restored To Examining Attorney
May 11, 2018
Exparte Appeal Received At Ttab
Feb 6, 2018
Attorney Review Completed
Jan 24, 2018
Correction From Ib Entered - Attorney Review Required
Dec 21, 2017
Change Of Name/Address Rec'd From Ib
Dec 15, 2017
Correction Transaction Received From Ib
Nov 13, 2017
Notification Of Final Refusal Emailed
Nov 13, 2017
Final Refusal E-Mailed
Nov 13, 2017
Final Refusal Written
Oct 26, 2017
Teas/Email Correspondence Entered
Oct 25, 2017
Correspondence Received In Law Office
Oct 25, 2017
Teas Response To Office Action Received
May 13, 2017
Refusal Processed By Ib
Apr 26, 2017
Non-Final Action Mailed - Refusal Sent To Ib
Apr 26, 2017
Refusal Processed By Mpu
Apr 25, 2017
Non-Final Action (Ib Refusal) Prepared For Review
Apr 24, 2017
Non-Final Action Written
Apr 14, 2017
Application Filing Receipt Mailed
Apr 10, 2017
Assigned To Examiner
Apr 10, 2017
New Application Office Supplied Data Entered
Apr 6, 2017
Sn Assigned For Sect 66a Appl From Ib
Trademark Alertz updated from USPTO on 2030-01-24
