9 [ Computer software for use in processing equipment for processing of electronic circuitry or semi-conductors, in particular of transistors or wafers; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, machines and apparatus for testing, namely, testing machines for semiconductors, tensile testing machines, optical inspection apparatus for inspection of semiconductor materials; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, electronic apparatus for testing semiconductor wafer conductivity and circuitry testing; Machines and apparatus for producing, aligning, adjusting, bonding, coating, laminating, developing, cleaning, printing, irradiating, thermal treatment and lithographic treatment of electronic circuits or semi-conductors, namely, ultrasonic inspection devices for non-medical and non-destructive testing, metal strength testing machines, semi-conductor wafer probes and wafer test metrology equipment for nanostructure-imprinting, hot-embossing, micro-contact printing, wafer testing, and package testing machines for electronic circuitry or semi-conductors; parts and equipment for the aforesaid machines and apparatus, included in this class, namely, batteries, electric wires and cables ]