Trademark: 79085813
Word

Status
Registered
Status Code
706
Status Date
Monday, April 4, 2022
Serial Number
79085813
Registration Number
4069118
Registration Date
Tuesday, December 13, 2011
Mark Type
2000
Filing Date
Thursday, May 13, 2010
Published for Opposition
Tuesday, September 27, 2011

Trademark Owner History
FUJI CORPORATION - Original Registrant
FUJI MACHINE MFG. CO., LTD. - Owner At Publication

Classifications
7 Machines used in assembly lines, namely, placers, mounters and inserters of electronic components for manufacturing and assembling printed circuit boards; electronic component inserters for machines used in manufacturing and assembling printed circuit boards; industrial printing machines, namely, screen printers for manufacturing and assembling printed circuit boards; power-operated viscous fluid dispensers for machines used in manufacturing and assembling printed circuit boards; [ machines for manufacturing and assembling printed circuit boards, namely, adhesive curing machines for assembling printed circuit boards; autogenous soldering machines used for manufacturing and assembling printed circuit boards; machines for manufacturing and assembling printed circuit boards, namely, feeders of printed circuit boards; parts of machines exclusively used for provisional storing of printed circuit boards in the process of manufacturing and assembling thereof; conveyors used for printed circuit boards * for semiconductor manufacturing machines and systems *; machines for manufacturing and assembling printed circuit boards, namely, machines that reverse the orientation of circuit boards; machines for manufacturing and assembling printed circuit boards, namely, machines that rotate circuit boards; power-operated tools, namely, buffers for printed circuit boards * for semiconductor manufacturing machines and systems *; loading and unloading machines for manufacturing and assembling printed circuit boards * for semiconductor manufacturing machines and systems *; machine parts, namely, adhesive tape cartridges that dispense tape for electronic component placers, mounters and inserters used to manufacture and assemble printed circuit boards * for semiconductor manufacturing machines and systems *; ] machines for manufacturing and assembling printed circuit boards, namely, electronic component feeders * for semiconductor manufacturing machines and systems *; machines for manufacturing semiconductors; metalworking machines and tools; power-operated metalworking machine tools, namely, turning tools; lathes for metalworking; machining centres; [ automatic assembling machines for assembling printed circuit boards, LED circuit boards, semiconductors, medical apparatus, lighting apparatus, LED light machines, photographic instruments, automobiles, and batteries, namely, plasma processing machines, plasma cleaning machines, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, and plasma modification machines * apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof *; ] automatic assembling machines for assembling circuit boards, LED circuit boards, electronic circuits, telecommunication * machines * [ devices and apparatus ], photographic * machines * [ instruments and apparatus ], cinematographic * machines * [ instruments and apparatus, lighting apparatus, LED light machines ], power distribution or control machines [ and apparatus, batteries ] and * fuel cells, solar cells and secondary * cells, AC motors and DC motors, metalworking machines, medical machines and game machines
The mark consists of a diamond design composed of nine smaller shaded diamonds.
In the statement, Page 1, line 36 through page 2, line 1 through 3 "plasma processing machines, plasma cleaning machines, namely, plasma reforming machines, plasma sterilization machines, plasma surface treatment machines, namely, and plasma modification machines" should be deleted, and "apparatus for treating a surface of semiconductor substrates using plasma; apparatus for cleaning a semiconductor substrates using plasma; apparatus for treating a surface using plasma for improving adhesiveness by providing asperities on an adhesive surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and an adhesive surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for treating a surface using plasma for improving hydrophilicity of a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and hydrophilicity of a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for cleaning by chemical reaction using plasma for removing a surface deposit (stains) on a surface of a material such as semiconductor substrate, metal, glass, rubber, plastic, synthetic resin, and ceramic, and a surface of a component formed of the same material used for various types of machinery and devices such as semiconductor devices, solar cell, electronic component, cutting tool, optical lens, and automobile component; apparatus for removing oxide film using plasma and used in processing semiconductor substrate and metal, and in a manufacturing process of semiconductor devices, electronic component, and metallic automobile component; etching apparatus using plasma for semiconductor material; apparatus for removing residue using plasma and used in a manufacturing process of semiconductor substrate; apparatus for hardening metal surface using plasma for improving abrasion resistance of cutting tool; surface treatment apparatus using plasma for ceramic material and used for processing to facilitate film formation of prosthesis on surfaces of joints in artificial bones and artificial joints in manufacturing thereof" should be inserted.
Color is not claimed as a feature of the mark.

Trademark Events
Mar 20, 2023
Partial Invalidation Processed By The Ib
Mar 16, 2023
Teas Change Of Correspondence Received
Mar 16, 2023
Attorney/Dom.Rep.Revoked And/Or Appointed
Mar 16, 2023
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Jan 24, 2023
Partial Invalidation Of Reg Ext Protection Sent To Ib
Jan 24, 2023
Invalidation Processed
Dec 4, 2022
Partial Invalidation Of Reg Ext Protection Created
Apr 4, 2022
Notice Of Acceptance Of Sec. 71 - E-Mailed
Apr 4, 2022
Registered-Sec.71 Accepted
Apr 4, 2022
Case Assigned To Post Registration Paralegal
Aug 30, 2021
Teas Section 71 Received
Dec 13, 2020
Courtesy Reminder - Sec. 71 (10-Yr) E-Mailed
Jun 4, 2020
International Registration Renewed
Dec 6, 2018
Change Of Name/Address Rec'd From Ib
May 1, 2018
Review Of Correspondence Complete - Address Not Updated
Apr 23, 2018
Case Assigned To Post Registration Paralegal
Mar 13, 2018
Notice Of Acceptance Of Sec. 71 & 15 - E-Mailed
Mar 13, 2018
Registered - Sec. 71 Accepted & Sec. 15 Ack.
Nov 14, 2017
Case Assigned To Post Registration Paralegal
Oct 12, 2017
Teas Section 71 & 15 Received
Dec 13, 2016
Courtesy Reminder - Sec. 71 (6-Yr) E-Mailed
Jun 26, 2014
Invalidation Reviewed - No Action Required By Office
Jan 8, 2014
Partial Invalidation Of Reg Ext Protection Created
May 8, 2013
Limitation From The Ib Examined And Entered
May 8, 2013
Correction Under Section 7 ¿ Processed
May 8, 2013
Assigned To Paralegal
Feb 4, 2013
Limitation Of Goods Received From Ib
May 25, 2012
Notification Processed By Ib
Apr 13, 2012
Final Decision Transaction Processed By Ib
Mar 19, 2012
Final Disposition Notice Sent To Ib
Mar 19, 2012
Final Disposition Processed
Mar 13, 2012
Final Disposition Notice Created, To Be Sent To Ib
Dec 13, 2011
Registered-Principal Register
Sep 27, 2011
Official Gazette Publication Confirmation E-Mailed
Sep 27, 2011
Published For Opposition
Sep 7, 2011
Notification Of Possible Opposition Sent To Ib
Sep 7, 2011
Notice Of Start Of Opposition Period Created, To Be Sent To Ib
Aug 22, 2011
Law Office Publication Review Completed
Aug 16, 2011
Approved For Pub - Principal Register
Jul 15, 2011
Teas/Email Correspondence Entered
Jul 15, 2011
Correspondence Received In Law Office
Jun 30, 2011
Assigned To Lie
Jun 20, 2011
Teas Request For Reconsideration Received
Apr 5, 2011
Notification Of Final Refusal Emailed
Apr 5, 2011
Final Refusal E-Mailed
Apr 5, 2011
Final Refusal Written
Mar 11, 2011
Attorney/Dom.Rep.Revoked And/Or Appointed
Mar 11, 2011
Teas Revoke/App/Change Addr Of Atty/Dom Rep Received
Mar 11, 2011
Teas/Email Correspondence Entered
Mar 11, 2011
Correspondence Received In Law Office
Mar 11, 2011
Teas Response To Office Action Received
Oct 3, 2010
Refusal Processed By Ib
Sep 13, 2010
Non-Final Action Mailed - Refusal Sent To Ib
Sep 13, 2010
Refusal Processed By Mpu
Sep 12, 2010
Non-Final Action (Ib Refusal) Prepared For Review
Sep 11, 2010
Non-Final Action Written
Sep 7, 2010
Application Filing Receipt Mailed
Sep 3, 2010
Assigned To Examiner
Sep 3, 2010
New Application Office Supplied Data Entered
Sep 2, 2010
Sn Assigned For Sect 66a Appl From Ib

Trademark Alertz updated from USPTO on 2030-01-24