Trademark: 79070214
Word
ALCSP
Status
Dead
Status Code
404
Status Date
Sunday, December 23, 2018
Serial Number
79070214
Registration Number
3856878
Registration Date
Tuesday, October 5, 2010
Mark Type
5000
Filing Date
Monday, December 22, 2008
Published for Opposition
Tuesday, July 20, 2010
Cancellation Date
Sunday, December 23, 2018

Trademark Owner History
Elpida Memory, Inc. - Original Registrant

Classifications
9 Semiconductor devices; semiconductor chips; integrated circuits; integrated circuit chips, namely, integrated circuit chips for use in electronic integrated circuits; integrated circuit chips for use in circuit boards; integrated circuit chips for use in integrated circuit cards; integrated circuit chips for use in integrated circuit modules; integrated circuit chips for use as a component of computers, computer workstations, server computers, personal computers, computer peripheral equipment, digital appliances, digital consumer electronic devices, digital home electrical appliances, mobile computers, video game consoles, home video game machines, mechatronic devices, electronic business equipment, electronic industrial instruments, office automation equipment, computer networking hardware, automobile electronic in-car devices, vehicle equipment, sensors, integrated circuit cards, point-of-sale terminals, printers, hard disk drives, digital audio-visual equipment, digital televisions, digital audio players, digital still cameras, optical and magneto-optical disc players and records digital video cameras, DVD recorder/players, HDD recorders, telephones, fax machines, mobile phones, car audio equipment, car navigation computers, and personal navigation computers; integrated circuit modules; integrated circuit packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); semiconductor memory; dynamic random access memory; semiconductor memory units; dynamic random access memory modules; electronic circuits; large scale integrated circuits; semiconductor wafers; integrated circuit (IC) memories, namely, semi-conductor memory units for integrated circuits; computer software for designing of integrated circuits
40 Assembly of products for others, namely, semiconductor devices and semiconductor device packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling for others in the field of integrated circuits and integrated circuit packages consisting of semiconductor devices, semiconductor memory devices and integrated circuits; manufacturing and assembling of semi-conductors and integrated circuits for others; manufacturing and assembling of semi-conductors for others; manufacturing and assembling of structured semiconductor wafers for others; providing information about manufacturing services for others in the field of semiconductors; providing information about manufacturing services for others in the field of semiconductor power elements; providing information about manufacturing services for others in the field of integrated circuits; providing information about manufacturing services for others in the field of structured semiconductor wafers
42 Design for others in the field of semiconductor device packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); testing, inspection or research on semiconductor power elements, semiconductor devices, integrated circuits, semiconductor memory, dynamic random access memory, and semiconductor device packages and integrated circuit (IC) packages consisting of surface mount packaging used as a component of integrated circuits in the nature of ball grid arrays (BGA) and land grid arrays (LGA); design for others in the field of integrated circuits; design for others in the field of semi-conductors, semiconductor power elements and integrated circuits; providing on-line non-downloadable computer programs for designing of processing technology, processing devices and electric circuit modeling of integrated circuits, namely, software for use in the design and manufacture of integrated circuits; providing information about product development and design for others in the field of semiconductor integrated circuits; providing information about inspection of semi-conductors; providing information about designing of semi-conductors for others; advisory and consultancy services relating to the designing of integrated circuits for others; product research and development and design for others in the field of semiconductor elements, integrated circuit and electronic circuits, advisory, consultancy and information services relating to product research and development and design for others in the field of semiconductor elements, integrated circuits and electronic circuits
Color is not claimed as a feature of the mark.
A L C S P

Trademark Events
Jul 12, 2019
Notification Of Effect Of Cancellation Of Intl Reg E-Mailed
Jul 12, 2019
Death Of International Registration
Feb 23, 2018
Total Invalidation Processed By The Ib
Jan 24, 2018
Total Invalidation Of Reg Ext Protection Sent To Ib
Jan 24, 2018
Invalidation Processed
Jan 12, 2018
Total Invalidation Of Reg Ext Protection Created
May 12, 2017
Cancelled Section 71
Oct 5, 2015
Courtesy Reminder - Sec. 71 (6-Yr) E-Mailed
Feb 11, 2015
Teas Change Of Correspondence Received
Feb 12, 2013
Final Decision Transaction Processed By Ib
Jan 10, 2011
Final Disposition Notice Sent To Ib
Jan 6, 2011
Final Disposition Processed
Jan 5, 2011
Final Disposition Notice Created, To Be Sent To Ib
Oct 5, 2010
Registered-Principal Register
Jul 20, 2010
Official Gazette Publication Confirmation E-Mailed
Jul 20, 2010
Published For Opposition
Jun 15, 2010
Law Office Publication Review Completed
Jun 14, 2010
Approved For Pub - Principal Register
Jun 8, 2010
Teas/Email Correspondence Entered
Jun 8, 2010
Correspondence Received In Law Office
Jun 8, 2010
Teas Request For Reconsideration Received
Mar 26, 2010
Notification Of Final Refusal Emailed
Mar 26, 2010
Final Refusal E-Mailed
Mar 26, 2010
Final Refusal Written
Mar 3, 2010
Teas/Email Correspondence Entered
Mar 3, 2010
Correspondence Received In Law Office
Mar 3, 2010
Assigned To Lie
Feb 5, 2010
Teas Change Of Correspondence Received
Feb 5, 2010
Teas Response To Office Action Received
Sep 4, 2009
Refusal Processed By Ib
Aug 7, 2009
Non-Final Action Mailed - Refusal Sent To Ib
Aug 6, 2009
Refusal Processed By Mpu
Aug 6, 2009
Non-Final Action (Ib Refusal) Prepared For Review
Aug 5, 2009
Non-Final Action Written
Jul 31, 2009
Application Filing Receipt Mailed
Jul 27, 2009
Assigned To Examiner
Jul 27, 2009
New Application Office Supplied Data Entered In Tram
Jul 24, 2009
Limitation Of Goods/Services From Ib Entered
Jul 23, 2009
Sn Assigned For Sect 66a Appl From Ib

Trademark Alertz updated from USPTO on 2030-01-24