Trademark: 79069811
Status Date
Wednesday, April 3, 2019
Registration Number
3761473
Registration Date
Tuesday, March 16, 2010
Filing Date
Thursday, April 2, 2009
Published for Opposition
Tuesday, December 29, 2009
Cancellation Date
Wednesday, April 3, 2019
9 Semi-conductor packages consisting of semi-conductors arranged in layers with solder ball and copper wire used to mount and interconnect the semi-conductor layers
Oct 25, 2019
Notification Of Effect Of Cancellation Of Intl Reg Mailed
Oct 25, 2019
Death Of International Registration
Aug 4, 2017
Total Invalidation Processed By The Ib
Jun 28, 2017
Total Invalidation Of Reg Ext Protection Sent To Ib
Jun 28, 2017
Invalidation Processed
Jun 21, 2017
Total Invalidation Of Reg Ext Protection Created
Oct 21, 2016
Cancelled Section 71
May 22, 2014
New Representative At Ib Received
Feb 7, 2013
Final Decision Transaction Processed By Ib
Jul 6, 2010
Final Disposition Notice Sent To Ib
Jul 6, 2010
Final Disposition Processed
Jun 16, 2010
Final Disposition Notice Created, To Be Sent To Ib
Mar 16, 2010
Registered-Principal Register
Dec 29, 2009
Official Gazette Publication Confirmation E-Mailed
Dec 29, 2009
Published For Opposition
Nov 23, 2009
Law Office Publication Review Completed
Nov 23, 2009
Assigned To Lie
Nov 3, 2009
Teas Change Of Correspondence Received
Nov 4, 2009
Approved For Pub - Principal Register
Nov 3, 2009
Teas/Email Correspondence Entered
Nov 3, 2009
Correspondence Received In Law Office
Nov 3, 2009
Teas Response To Office Action Received
Aug 21, 2009
Refusal Processed By Ib
Jul 28, 2009
Non-Final Action Mailed - Refusal Sent To Ib
Jul 28, 2009
Refusal Processed By Mpu
Jul 28, 2009
Non-Final Action (Ib Refusal) Prepared For Review
Jul 27, 2009
Non-Final Action Written
Jul 24, 2009
Application Filing Receipt Mailed
Jul 20, 2009
Assigned To Examiner
Jul 20, 2009
New Application Office Supplied Data Entered In Tram
Jul 17, 2009
Sn Assigned For Sect 66a Appl From Ib
Trademark Alertz updated from USPTO on 2030-01-24
