Trademark: 79049625
Status Date
Friday, December 29, 2017
Filing Date
Friday, December 28, 2007
Abandoned Date
Friday, December 29, 2017
1 Reactive adhesives used for metal bonding, for fixing of SMD and other electronic components; single-component epoxy resins used for bonding, fixing or encapsulating SMD and other electronic components
Jul 21, 2018
Notification Of Effect Of Cancellation Of Intl Reg Mailed
Jul 20, 2018
Death Of International Registration
May 31, 2015
New Representative At Ib Received
Aug 5, 2011
Change Of Name/Address Rec'd From Ib
Sep 14, 2010
Final Decision Transaction Processed By Ib
Jul 30, 2010
Final Disposition Notice Sent To Ib
Jul 30, 2010
Final Disposition Notice Created, To Be Sent To Ib
Aug 27, 2009
Notification Of Possible Opposition - Processed By Ib
Aug 7, 2009
Notification Of Possible Opposition Sent To Ib
Aug 6, 2009
Notification Of Possible Opposition Created, To Be Sent To Ib
Jul 30, 2009
Abandonment Notice Mailed - Failure To Respond
Jul 30, 2009
Abandonment - Failure To Respond Or Late Response
Dec 3, 2008
Non-Final Action Mailed
Dec 2, 2008
Non-Final Action Written
Oct 21, 2008
Teas/Email Correspondence Entered
Oct 20, 2008
Correspondence Received In Law Office
Oct 21, 2008
Assigned To Lie
Oct 20, 2008
Teas Response To Office Action Received
Aug 21, 2008
Applicant/Correspondence Changes (Non-Responsive) Entered
Aug 21, 2008
Assigned To Lie
Aug 14, 2008
Paper Received
May 9, 2008
Refusal Processed By Ib
Apr 18, 2008
Non-Final Action Mailed - Refusal Sent To Ib
Apr 18, 2008
Refusal Processed By Mpu
Apr 18, 2008
Non-Final Action (Ib Refusal) Prepared For Review
Apr 17, 2008
Non-Final Action Written
Mar 30, 2008
Assigned To Examiner
Mar 7, 2008
New Application Entered In Tram
Mar 6, 2008
Sn Assigned For Sect 66a Appl From Ib
Trademark Alertz updated from USPTO on 2030-01-24
