Trademark: 78841899
Status Date
Friday, June 8, 2018
Registration Number
3332289
Registration Date
Tuesday, November 6, 2007
Filing Date
Tuesday, March 21, 2006
Published for Opposition
Tuesday, November 14, 2006
Cancellation Date
Friday, June 8, 2018
40 Custom manufacture of semiconductor wafers and chips, namely, solder bumps on electroless metal under bump metallurgy incorporating the adherence of solder spheres to electroless metal on semiconductor wafers and chips
In the statement, Column 1, line 2, "LIMITED LIABILITY CORPORATION" should be deleted, and LIMITED LIABILITY COMPANY should be inserted.
ELITE FLIP CHIP
Jun 8, 2018
Cancelled Sec. 8 (10-Yr)/Expired Section 9
Nov 18, 2014
Certificate Of Correction Issued
Nov 12, 2014
Paper Received
Nov 11, 2014
Fax Received
Jun 12, 2014
Post Registration Action Mailed - Sec. 7
Mar 20, 2014
Teas Response To Office Action-Post Reg Received
Nov 7, 2013
Post Registration Action Mailed - Sec. 8 & 15
Nov 7, 2013
Case Assigned To Post Registration Paralegal
Oct 22, 2013
Teas Section 8 & 15 Received
Nov 6, 2007
Registered-Principal Register
Oct 3, 2007
Law Office Registration Review Completed
Oct 2, 2007
Assigned To Lie
Sep 3, 2007
Allowed Principal Register - Sou Accepted
Aug 30, 2007
Statement Of Use Processing Complete
Aug 30, 2007
Extension 1 Granted
Jul 5, 2007
Use Amendment Filed
Jul 5, 2007
Extension 1 Filed
Jul 5, 2007
Teas Extension Received
Jul 5, 2007
Teas Statement Of Use Received
Feb 6, 2007
Noa Mailed - Sou Required From Applicant
Nov 14, 2006
Published For Opposition
Oct 25, 2006
Notice Of Publication
Sep 25, 2006
Law Office Publication Review Completed
Sep 8, 2006
Assigned To Lie
Sep 7, 2006
Approved For Pub - Principal Register
Sep 7, 2006
Examiner's Amendment Entered
Sep 7, 2006
Examiners Amendment E-Mailed
Sep 7, 2006
Examiners Amendment -Written
Sep 6, 2006
Assigned To Examiner
Mar 24, 2006
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
