Trademark: 78710528
Status Date
Friday, September 21, 2007
Filing Date
Saturday, September 10, 2005
Published for Opposition
Tuesday, December 26, 2006
Abandoned Date
Friday, September 21, 2007
17 INSULATING INTERLAYER DIELECTRIC MATERIALS FOR USE IN SEMICONDUCTOR DEVICES; PACKAGING MATERIALS OF MOLD COMPOUND AND INSULATING MATERIALS, NAMELY POXY RESIN, FOR USE IN SEMICONDUCTOR DEVICES
Dec 31, 2007
Abandonment Notice Mailed - No Use Statement Filed
Dec 7, 2007
Abandonment - No Use Statement Filed
Mar 20, 2007
Noa Mailed - Sou Required From Applicant
Dec 26, 2006
Published For Opposition
Dec 6, 2006
Notice Of Publication
Nov 6, 2006
Law Office Publication Review Completed
Oct 27, 2006
Assigned To Lie
Oct 25, 2006
Approved For Pub - Principal Register
Sep 29, 2006
Teas/Email Correspondence Entered
Sep 28, 2006
Correspondence Received In Law Office
Sep 28, 2006
Teas Response To Office Action Received
Jun 5, 2006
Attorney Revoked And/Or Appointed
Jun 5, 2006
Teas Revoke/Appoint Attorney Received
May 4, 2006
Applicant/Correspondence Changes (Non-Responsive) Entered
Mar 25, 2006
Non-Final Action E-Mailed
Mar 25, 2006
Non-Final Action Written
Mar 21, 2006
Assigned To Examiner
Oct 26, 2005
Paper Received
Oct 19, 2005
Teas Change Of Correspondence Received
Sep 19, 2005
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
