Trademark: 78565595
Status Date
Tuesday, April 18, 2006
Filing Date
Friday, February 11, 2005
Abandoned Date
Friday, March 10, 2006
1 Copper Interconnect Electroplating Chemistry for High Performance Integrated Chips, Microelectromechanical Systems (MEMS) and Packaging Applications
Apr 18, 2006
Abandonment Notice Mailed - Failure To Respond
Apr 18, 2006
Abandonment - Failure To Respond Or Late Response
Sep 9, 2005
Non-Final Action E-Mailed
Sep 9, 2005
Non-Final Action Written
Sep 9, 2005
Assigned To Examiner
Feb 24, 2005
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24