Trademark: 78377315
Status Date
Friday, April 5, 2013
Registration Number
3136563
Registration Date
Tuesday, August 29, 2006
Filing Date
Tuesday, March 2, 2004
Published for Opposition
Tuesday, December 20, 2005
Cancellation Date
Friday, April 5, 2013
40 Custom manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices; manufacture of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the order and/or specification of others; wafer, semiconductor and integrated circuit manufacturing, assembling and packaging services for others; semiconductor and integrated circuit cutting, molding and etching for others; integrated circuit wafer foundry services for others; integrated circuit photo mask and electronic chip or computer chip manufacturing to the order and/or specification of others; wafer, chip and semiconductor manufacturing to the order and/or specification of others, integrated circuit assembling services for others; silicon wafer photolithography, etching, thin film, diffusion, ion implanting and chemical mechanical polishing services for others; manufacture of printed circuits to the order and/or specification of others; photo mask manufacturing services for others; wafer probing services for others; manufacture of microdisplay devices, including liquid crystal on silicon devices, to the order and/or specification of others; manufacture of smart cards and sim cards for others
42 Design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; custom design of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, to the specification of others; simulation, namely, testing, verification and analysis of wafers, semiconductors and integrated circuits, including application-specific integrated circuits, logic devices, mixed-signal devices and memory devices, for others; design of printed circuits for others; photo mask design services for others; design of microdisplay devices, including liquid crystal on silicon devices, for others; design of smart cards and sim cards for others
The mark consists of Two Chinese characters.
The non-Latin character(s) in the mark transliterates into Zhong-Xin, and this means center or pivot or main point in English.
Apr 5, 2013
Cancelled Sec. 8 (6-Yr)
Aug 29, 2006
Registered-Principal Register
Aug 7, 2006
Attorney Revoked And/Or Appointed
Aug 7, 2006
Teas Revoke/Appoint Attorney Received
Jul 13, 2006
Law Office Registration Review Completed
Jul 7, 2006
Assigned To Lie
Jul 5, 2006
Allowed Principal Register - Sou Accepted
Jun 29, 2006
Statement Of Use Processing Complete
Jun 29, 2006
Extension 1 Granted
Jun 12, 2006
Use Amendment Filed
Jun 12, 2006
Extension 1 Filed
Jun 12, 2006
Teas Extension Received
Jun 12, 2006
Teas Statement Of Use Received
Mar 14, 2006
Noa Mailed - Sou Required From Applicant
Dec 20, 2005
Published For Opposition
Nov 30, 2005
Notice Of Publication
Oct 27, 2005
Law Office Publication Review Completed
Oct 18, 2005
Assigned To Lie
Oct 7, 2005
Approved For Pub - Principal Register
Oct 7, 2005
Examiners Amendment E-Mailed
Oct 7, 2005
Examiners Amendment -Written
Oct 6, 2005
Teas/Email Correspondence Entered
Sep 28, 2005
Correspondence Received In Law Office
Sep 28, 2005
Teas Response To Office Action Received
Mar 28, 2005
Non-Final Action E-Mailed
Mar 28, 2005
Non-Final Action Written
Mar 28, 2005
Teas/Email Correspondence Entered
Mar 19, 2005
Correspondence Received In Law Office
Mar 19, 2005
Teas Response To Office Action Received
Sep 19, 2004
Non-Final Action E-Mailed
Sep 19, 2004
Non-Final Action Written
Sep 18, 2004
Assigned To Examiner
Mar 18, 2004
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
