40 Services for the treatment of semiconductor materials substrates and silicon wafers for the manufacture of integrated circuits, namely, modification of mechanical, physical, chemical, electrical properties of semiconductor materials substrates and silicon wafers by thermal treatment, ion implantation, chemical treatment, chemical-mechanical-polishing treatment and all treatment used in the semiconductor industry; transfer of microelectronics circuits, namely, integrated circuits, or of micro-systems, namely, pressure sensors, accelerometer, gyrometer, optical sensors, bio-sensors, magnetic sensors and actuators, onto different types of support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, piezoelectric support materials; mechanical, chemical and physical treatment and machining of surfaces of wafers; stacking of integrated circuits, namely custom fabrication of semi-conductors for others; treatment of wafers for micro-electronics and any derived activities, namely, nano-electronics, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; fabrication of micro-systems as described by technologies coming from microelectronics, namely, prototype fabrication of new products for others in the field of microelectronics; treatment of silicon circuit boards and semiconductors, namely, bonding of a wafer onto another wafer, thinning down by chemical etching or mechanical grinding, polishing by chemical-mechanical-polishing; polishing of silicon circuit wafers and semiconductors, namely, modification of roughness of surface by chemical-mechanical-polishing treatment; transfer of silicon layers, semiconductors or components onto other support materials, namely semiconductor wafers, insulating wafers, namely silica, plastic, ceramics, piezoelectric support materials
Trademark: 78316644
