Trademark: 78221920
Word
MATERIALS INNOVATION
Status Date
Tuesday, December 3, 2013
Registration Number
2840228
Registration Date
Tuesday, May 11, 2004
Filing Date
Wednesday, March 5, 2003
Published for Opposition
Tuesday, February 17, 2004
7 [ Semiconductor manufacturing machines and components thereof; Polishing pads for polishing machines for use in the manufacture of semiconductor wafers ]
1 Chemicals for use in the manufacture of semiconductor devices, printed wiring boards and display panels; Chemical polishing slurry for use in the manufacture of semiconductor wafers; Unprocessed synthetic resins for use in the manufacture of electronic components; Photo resists, dry film resists, solder resists and other chemical resists, for use in the manufacture of electronic components
May 10, 2010
Teas Section 8 & 15 Received
Aug 26, 2003
Assigned To Examiner
Sep 4, 2003
Non-Final Action E-Mailed
Oct 30, 2003
Paper Received
Oct 30, 2003
Correspondence Received In Law Office
Oct 30, 2003
Sec. 1(B) Claim Deleted
Dec 4, 2003
Approved For Pub - Principal Register
Jan 28, 2004
Notice Of Publication
Feb 17, 2004
Published For Opposition
May 11, 2004
Registered-Principal Register
May 11, 2023
Courtesy Reminder - Sec. 8 (10-Yr)/Sec. 9 E-Mailed
May 24, 2010
Case Assigned To Post Registration Paralegal
May 25, 2010
Registered - Sec. 8 (6-Yr) Accepted & Sec. 15 Ack.
Oct 8, 2013
Notice Of Acceptance Of Sec. 8 & 15 - E-Mailed
Nov 14, 2013
Teas Section 8 & 9 Received
Nov 14, 2013
Registered - Combined Section 8 (10-Yr) & Sec. 9 Filed
Dec 3, 2013
Registered - Sec. 8 (10-Yr) Accepted/Sec. 9 Granted
Dec 3, 2013
Registered And Renewed (First Renewal - 10 Yrs)
Dec 3, 2013
Case Assigned To Post Registration Paralegal
Dec 3, 2013
Notice Of Acceptance Of Sec. 8 & 9 - E-Mailed
Apr 16, 2024
Teas Section 8 & 9 Received
Trademark Alertz updated from USPTO on 2030-01-24
