Trademark: 78159072
Status Date
Wednesday, January 26, 2005
Filing Date
Thursday, August 29, 2002
Published for Opposition
Tuesday, April 27, 2004
Abandoned Date
Wednesday, January 26, 2005
7 Semiconductor chip assembly machines, namely, wire bonders utilized for establishing the electrical connections between chip and substrate material through use of gold or copper wire
Jan 26, 2005
Abandonment Notice Mailed - Express Abandonment
Jan 26, 2005
Abandonment - Express Mailed
Jan 26, 2005
Teas Express Abandonment Received
Jan 25, 2005
Reg. Cancelled - Restored To Pendency
Jul 20, 2004
Registered-Principal Register
Apr 27, 2004
Published For Opposition
Apr 7, 2004
Notice Of Publication
Jan 20, 2004
Sec. 1(B) Claim Deleted
Feb 13, 2004
Approved For Pub - Principal Register
Jan 20, 2004
Correspondence Received In Law Office
Jan 20, 2004
Paper Received
Oct 29, 2003
Non-Final Action Mailed
Sep 8, 2003
Correspondence Received In Law Office
Sep 8, 2003
Paper Received
Aug 5, 2003
Letter Of Suspension Mailed
Jun 19, 2003
Correspondence Received In Law Office
Jul 1, 2003
Case File In Ticrs
Jun 19, 2003
Paper Received
Mar 12, 2003
Letter Of Suspension Mailed
Jan 9, 2003
Correspondence Received In Law Office
Jan 27, 2003
Non-Final Action Mailed
Jan 9, 2003
Paper Received
Jan 17, 2003
Assigned To Examiner
Trademark Alertz updated from USPTO on 2030-01-24
