Trademark: 77092585
Word
INTEGRATED PACKAGE ON PACKAGE
Status Date
Monday, February 23, 2009
Filing Date
Friday, January 26, 2007
Abandoned Date
Sunday, December 28, 2008
9 Semiconductor package modules comprised of semiconductor dies and signal routing structures
40 Custom fabrication, namely, the assembly and encapsulation of semiconductor devices for others
42 Design of packaging for semiconductor devices for others, and testing of semiconductor devices
Feb 23, 2009
Abandonment Notice Mailed - Failure To Respond
Feb 23, 2009
Abandonment - Failure To Respond Or Late Response
Jun 26, 2008
Non-Final Action Mailed
Jun 26, 2008
Non-Final Action Written
Jun 23, 2008
Assigned To Examiner
Jun 20, 2008
Teas/Email Correspondence Entered
Jun 20, 2008
Correspondence Received In Law Office
Jun 20, 2008
Teas Response To Office Action Received
Jan 3, 2008
Non-Final Action Mailed
Jan 2, 2008
Non-Final Action Written
Dec 20, 2007
Amendment From Applicant Entered
Dec 20, 2007
Correspondence Received In Law Office
Dec 20, 2007
Assigned To Lie
Nov 9, 2007
Paper Received
May 16, 2007
Non-Final Action Mailed
May 15, 2007
Non-Final Action Written
May 14, 2007
Assigned To Examiner
Jan 30, 2007
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
