Trademark: 77060804
Word
GOLD CHIP TECHNOLOGY
Status
Dead
Status Code
602
Status Date
Tuesday, April 29, 2008
Serial Number
77060804
Mark Type
4000
Filing Date
Sunday, December 10, 2006
Abandoned Date
Tuesday, March 18, 2008

Trademark Owner History

Classifications
42 Technology employed to manufacture electronic components containing gold pads for attaching, mounting, interconnecting, integrating them into a larger circuit, system , board or package via wire bond or flip chip

Trademark Events
Apr 29, 2008
Abandonment Notice Mailed - Failure To Respond
Apr 29, 2008
Abandonment - Failure To Respond Or Late Response
Apr 23, 2008
Assigned To Examiner
Sep 17, 2007
Notification Of Non-Final Action E-Mailed
Sep 17, 2007
Non-Final Action E-Mailed
Sep 17, 2007
Non-Final Action Written
Apr 9, 2007
Non-Final Action E-Mailed
Apr 9, 2007
Non-Final Action Written
Apr 3, 2007
Assigned To Examiner
Dec 13, 2006
New Application Entered In Tram

Trademark Alertz updated from USPTO on 2030-01-24