Trademark: 77060804
Word
GOLD CHIP TECHNOLOGY
Status Date
Tuesday, April 29, 2008
Filing Date
Sunday, December 10, 2006
Abandoned Date
Tuesday, March 18, 2008
42 Technology employed to manufacture electronic components containing gold pads for attaching, mounting, interconnecting, integrating them into a larger circuit, system , board or package via wire bond or flip chip
Apr 29, 2008
Abandonment Notice Mailed - Failure To Respond
Apr 29, 2008
Abandonment - Failure To Respond Or Late Response
Apr 23, 2008
Assigned To Examiner
Sep 17, 2007
Notification Of Non-Final Action E-Mailed
Sep 17, 2007
Non-Final Action E-Mailed
Sep 17, 2007
Non-Final Action Written
Apr 9, 2007
Non-Final Action E-Mailed
Apr 9, 2007
Non-Final Action Written
Apr 3, 2007
Assigned To Examiner
Dec 13, 2006
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24