Trademark: 77006230
Status Date
Friday, October 31, 2014
Registration Number
3402369
Registration Date
Tuesday, March 25, 2008
Filing Date
Monday, September 25, 2006
Published for Opposition
Tuesday, September 25, 2007
Cancellation Date
Friday, October 31, 2014
7 Electronics assembly machines that complement and enhance standard surface mount equipment for the automotive, component assembly, telecommunications, and medical markets, namely, semiconductor manufacturing machines, component and printed circuit board assembly machines in the nature of manufacturing machines for performing one or more of the following functions, namely, orienting, feeding, mounting and bonding electronic semiconductor components together and onto printed circuit boards, semiconductor wafer processing machines and semiconductor substrates manufacturing machines; semiconductor manufacturing machines featuring component and die feeders, conveyors, process peripherals and flexible process cells; semiconductor manufacturing machines for use in flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment
9 Electrical controllers and computer software for use in controlling electronics and semiconductor component assembly machines, all for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer software for determining optimum processes for assembling electronics and semiconductor components, for use by customers in the automotive, component assembly, telecommunications, and medical markets; computer based apparatus for designing the layout of electronic circuits; electrical controllers and computer software for use in controlling semiconductor manufacturing machines that perform flip chip and die bonding, hybrid module assembly, and mechanical assembly utilizing surface mount and insertion mount equipment
40 Consulting for others in the field of electronics assembly and processes for assembling semiconductor components; providing information to others in the field of electronics and semiconductor component assembly related to flip chip and die bonding, hybrid module assembly, and mechanical assembly
42 Research and development in the field of surface mount and insertion mount electronics assembly equipment; engineering services in the field of electronics assembly equipment for customers in the automotive, semiconductor component assembly, telecommunications, and medical markets; design, development and testing of new products for others in the field of electronics assembly equipment
Oct 31, 2014
Cancelled Sec. 8 (6-Yr)
Apr 18, 2012
Assignment Of Ownership Not Updated Automatically
Jul 14, 2010
Assignment Of Ownership Not Updated Automatically
Mar 25, 2008
Registered-Principal Register
Feb 20, 2008
Law Office Registration Review Completed
Feb 20, 2008
Allowed Principal Register - Sou Accepted
Feb 20, 2008
Statement Of Use Processing Complete
Jan 24, 2008
Use Amendment Filed
Jan 24, 2008
Teas Statement Of Use Received
Dec 18, 2007
Noa Mailed - Sou Required From Applicant
Sep 25, 2007
Published For Opposition
Sep 5, 2007
Notice Of Publication
Aug 17, 2007
Law Office Publication Review Completed
Aug 17, 2007
Examiners Amendment Mailed
Aug 16, 2007
Approved For Pub - Principal Register
Aug 16, 2007
Examiner's Amendment Entered
Aug 16, 2007
Examiners Amendment -Written
Aug 1, 2007
Final Refusal Mailed
Jul 31, 2007
Final Refusal Written
Jul 12, 2007
Teas/Email Correspondence Entered
Jul 12, 2007
Correspondence Received In Law Office
Jul 12, 2007
Assigned To Lie
Jun 27, 2007
Teas Response To Office Action Received
Feb 14, 2007
Non-Final Action Mailed
Feb 13, 2007
Non-Final Action Written
Feb 9, 2007
Assigned To Examiner
Nov 29, 2006
Assignment Of Ownership Not Updated Automatically
Sep 29, 2006
New Application Entered In Tram
Trademark Alertz updated from USPTO on 2030-01-24
